Conductive Coating Formulations with Low Silver Content

Bao, Liwei; Wei, Bin; Xiao, A.Y.

doi:10.1109/ectc.2007.373843

Cited by 8 publications

(5 citation statements)

References 8 publications

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“…After printing the second layer, the resin of the upper layer can freely penetrate the first layer. Therefore, the resin is deposited between the paper and the underlying ink, reducing the thickness of the ink layer (Liu et al , 2019; Bao et al , 2007).…”

Section: Discussionmentioning

confidence: 99%

Preparation and application of water-based nano-silver conductive ink in paper-based 3D printing

Zhao

Wang

2021

RPJ

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Purpose In flexible electronics applications, organic inks are mostly used for inkjet printing. Three-dimensional (3 D) printing technology has the advantages of low cost, high speed and good precision in modern electronic printing. The purpose of this study is to solve the high cost of traditional printing and the pollution emissions of organic ink. It is necessary to develop a water-based conductive ink that is easily degradable and can be 3 D printed. A nano-silver ink printed circuit pattern with high precision, high conductivity and good mechanical properties is a promising strategy. Design/methodology/approach The researched nano-silver conductive ink is mainly composed of silver nanoparticles and resin. The effect of adding methyl cellulose on the ink was also explored. A simple 3 D circuit pattern was printed on photographic paper. The line width, line length, line thickness and conductivity of the printed circuit were tested. The influence of sintering temperature and sintering time on pattern resistivity was studied. The relationship between circuit pattern bending performance and electrical conductivity is analyzed. Findings The experimental results show that the ink has the characteristics of low silver content and good environmental protection effect. The printing feasibility of 3 D printing circuit patterns on paper substrates was confirmed. The best printing temperature is 160°C–180°C, and the best sintering time is 30 min. The circuit pattern can be folded 120°, and the cycle is folded more than 60 times. The minimum resistivity of the circuit pattern is 6.07 µΩ·cm. Methyl cellulose can control the viscosity of the ink. The mechanical properties of the pattern have been improved. The printing method of 3 D printing can significantly reduce the sintering time and temperature of the conductive ink. These findings may provide innovation for the flexible electronics industry and pave the way for alternatives to cost-effective solutions. Originality/value In this study, direct ink writing technology was used to print circuit patterns on paper substrates. This process is simple and convenient and can control the thickness of the ink layer. The ink material is nonpolluting to the environment. Nano-silver ink has suitable viscosity and pH value. It can meet the requirements of pneumatic 3 D printers. The method has the characteristics of simple process, fast forming, low cost and high environmental friendliness.

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Section: Discussionmentioning

confidence: 99%

Preparation and application of water-based nano-silver conductive ink in paper-based 3D printing

Zhao

Wang

2021

RPJ

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“…The thickness of the ink layer printed on the photo paper was 0.1 mm, while the thickness of the 3D model design was 0.15 mm. The thickness of the ink on the photo paper was much smaller than the designed thickness, and the photo paper had a coating and capillary structure with little diffusion of conductive fillers, but some of the resin penetrated the capillary structure of the paper (figure 6), leading to a reduction in the thickness of the ink film [26]. Figure 7 showed the ink cross section of the paper, that proved some of the resin penetrated the capillary structure of the paper.…”

Section: Line Pattern On the Circuit Boardmentioning

confidence: 98%

Preparation of paper-based conductive pattern for 3D printing

et al. 2023

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With the development of printed electronics technology, the demand for printed conductive inks had also put forward higher standards. The shortcomings of traditional printed circuit boards, such as complex technology, consumables, and pollution, had also been resolved with the development of 3D printing technology. In this paper, low-content silver nanoparticles were blended with graphene alcohol slurry and dissolved in a non-polluting solvent such as absolute ethanol. The synergistic effect of the composite of the hexagonal structure of the graphene sheet and the silver nanoparticles improved the ink’s performance of electrical conductivity, adding water-based polyurethane/acrylic resin system to improve the adhesion between ink and paper. The conductive ink can be used to 3D print circuit circuits on paper. After drying, the resistance was measured. After the battery, diode, and switch were connected, a circuit diagram was made. After pressing the diode emits was lighted. This work is expected to be applied to flexible circuit boards to provide basic research.

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“…Metallodielectric/polymer-matrix composite materials have received attention as a material platform for applications ranging from broadband power limiters for electromagnetic shielding to antistatic coatings and optical materials. − A general drawback associated with the addition of metals to polymer matrices is the increase of absorption thatin most circumstancesprevents the application of metal/polymer composite materials in areas where optical transparency is required. The strong absorption of metals arises due to fully occupied d-states in conjunction with the high free electron density close to the metals’ Fermi levels, thus giving rise to interband and plasma absorption of incident electromagnetic waves .…”

Section: Introductionmentioning

confidence: 99%

Flexible Transparent Metal/Polymer Composite Materials Based on Optical Resonant Laminate Structures

Narayanan

Choi

Porter

2013

ACS Appl. Mater. Interfaces

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Suitable design of periodic metal/polymer composite materials is shown to facilitate resonant tunneling of light at absorbing wavelengths and to provide a means to significantly reduce optical absorption losses in polymer-based metallodielectric composite structures. The conditions for resonant tunneling are established based on the concept of "photonic band edge alignment" in 1D-periodic systems. For the particular case of a four-layer gold/polystyrene laminate structure, it is shown that the matching of the lower band edge of the 1D-periodic structure with the plasma frequency of the metal component facilitates the increase of optical transmission by about 500% as compared to monolithic film structures of equal total thickness. The effect of sheet thickness on the optical properties of thin metal films is determined and shown to be an important prerequisite for the reliable prediction of resonant metallodielectric structures. The resonant 1D-periodic metal/polymer heterostructures are shown to retain the flexural stability of the polymer matrix and thus could find application as flexible transparent conductors in areas such as "plastic electronics".

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Conductive Coating Formulations with Low Silver Content

Cited by 8 publications

References 8 publications

Preparation and application of water-based nano-silver conductive ink in paper-based 3D printing

Preparation and application of water-based nano-silver conductive ink in paper-based 3D printing

Preparation of paper-based conductive pattern for 3D printing

Flexible Transparent Metal/Polymer Composite Materials Based on Optical Resonant Laminate Structures

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