Conformal microstrip array antenna with the omnidirectional pattern for 5G applications

Abstract

This letter presents an omnidirectional conformal array microstrip patch antenna at 3.5 GHz band. The array of 1 × 2 elements are used as a radiating element and placed on the planar face of a regular six-faced hexagonal structure connected with six faced feeding network. The feeding network consists of one three-way power divider and two two-way power dividers.These power dividers are serially connected to each other and form a six-faced regular structure with 12 output ports. The response of the conformal antenna is verified experimentally. A measured reflection coefficient is well below <−10dB and isolation between the output ports are −20 dB. The proposed omnidirectional conformal antenna is low-cost, easy to fabricate, and suitable for an omnidirectional radiation pattern for 5G applications.

A dielectric‐loaded broadband single‐ and dual‐polarized slot antenna with low profile and low cross‐polarization

“…With the practical communication requirement covering multifrequency, there are gradually emerging many methods to improve the bandwidth of DRA. Summarized as follows, utilizing improved feeding structure such as parallel standing strips and conformal patch [15][16][17][18][19][20] excites the DRA to achieve broadband with DRA mode, which requires the profile of DRA high enough and hardly achieves a low profile. Therefore, the previous DRA mainly adopts slot coupling.…”

A Manufacturing Method for High-Reliability Multilayer Flexible Electronics by Electrohydrodynamic Printing

“…Additionally, the superb conformal ability of flexible circuits allows them to adhere to the curved surfaces of three-dimensional objects without being limited by installation space. For example, conformal circuits can be applied to radar antennas on aircraft surfaces, structural health monitoring sensors, etc., significantly reducing equipment weight and enhancing aerodynamic performance [5][6][7][8]. However, traditional silicon-based circuit manufacturing methods, which utilize photolithography, etching, and other processes, are unsuitable for fabrication flexible substrates such as polyethylene terephthalate (PET) and polydimethylsiloxane (PDMS).…”