“…This new technology effectively reduced the stress concentration of the chip during the pick-up process. To effectively realized the continuous peeling of flexible electronics devices on roll-to-roll substrates, a roll-to-roll conformal peeling method was developed [46]. To improve the manufacturing performance in the chip transfer process, a theoretical model for transfer efficiency was established.…”
Flexible electronics such as mechanically compliant displays, sensors and solar cells, have important applications in the fields of energy, national defence and biomedicine, etc. Various types of flexible electronics have been proposed or developed by the improvements in structural designs, material properties and device integrations. However, the manufacturing of flexible electronics receives little attention, which limits its mass production and industrialization. The increasing demands on the size, functionality, resolution ratio and reliability of flexible electronics bring several significant challenges in their manufacturing processes. This work aims to report the state-of-art technologies and applications of flexible electronics manufacturing. Three key technologies including electrohydrodynamic direct-writing, flip chip and automatic optical inspection are highlighted. The mechanism and developments of these technologies are discussed in detail. Based on these technologies, the present work develops three kinds of manufacturing equipment, i.e., inkjet printing manufacturing equipment, robotized additive manufacturing equipment, and roll-to-roll manufacturing equipment. The advanced manufacturing processes, equipment and systems for flexible electronics pave the way for applications of new displays, smart sensing skins and epidermal electronics, etc. By reviewing the developments of flexible electronics manufacturing technology and equipment, it can be found that the existing advances greatly promote the applications and commercialization of flexible electronics. Since flexible electronics manufacturing contains many multi-disciplinary problems, the current investigations are confronted with great challenges. Therefore, further developments of the reviewed manufacturing technology and equipment are necessary to break the current limitations of manufacturing resolution, efficiency and reliability. flexible electronics, micro/nano manufacturing, electrohydrodynamic direct-writing, flip chip, automatic optical inspection
“…This new technology effectively reduced the stress concentration of the chip during the pick-up process. To effectively realized the continuous peeling of flexible electronics devices on roll-to-roll substrates, a roll-to-roll conformal peeling method was developed [46]. To improve the manufacturing performance in the chip transfer process, a theoretical model for transfer efficiency was established.…”
Flexible electronics such as mechanically compliant displays, sensors and solar cells, have important applications in the fields of energy, national defence and biomedicine, etc. Various types of flexible electronics have been proposed or developed by the improvements in structural designs, material properties and device integrations. However, the manufacturing of flexible electronics receives little attention, which limits its mass production and industrialization. The increasing demands on the size, functionality, resolution ratio and reliability of flexible electronics bring several significant challenges in their manufacturing processes. This work aims to report the state-of-art technologies and applications of flexible electronics manufacturing. Three key technologies including electrohydrodynamic direct-writing, flip chip and automatic optical inspection are highlighted. The mechanism and developments of these technologies are discussed in detail. Based on these technologies, the present work develops three kinds of manufacturing equipment, i.e., inkjet printing manufacturing equipment, robotized additive manufacturing equipment, and roll-to-roll manufacturing equipment. The advanced manufacturing processes, equipment and systems for flexible electronics pave the way for applications of new displays, smart sensing skins and epidermal electronics, etc. By reviewing the developments of flexible electronics manufacturing technology and equipment, it can be found that the existing advances greatly promote the applications and commercialization of flexible electronics. Since flexible electronics manufacturing contains many multi-disciplinary problems, the current investigations are confronted with great challenges. Therefore, further developments of the reviewed manufacturing technology and equipment are necessary to break the current limitations of manufacturing resolution, efficiency and reliability. flexible electronics, micro/nano manufacturing, electrohydrodynamic direct-writing, flip chip, automatic optical inspection
“…Figure A4 b shows a home-made peel platform whose peel angle and peel rate can be controlled. More detail about this platform can be found in [ 39 ]. A rectangle sample of PVC sticker with a length of 200 mm and a width of is prepared for test.…”
Section: Figure A1mentioning
confidence: 99%
“…Three samples are tested to give an average peel force . Referring to the equation given in [ 39 ], the work of adhesion per unit area is . Figure A4 Experimental apparatus and experimental data for material parameter test: ( a ) an universal mechanical tester (INSTRON 5944); ( b ) a home-made peel platform with an angle-adjustable jig, in which the X or Z-motion of the translation stage is able to be driven by two independent linear/electric actuators, and its Y-motion depends on a manually single axis table; ( c ) stress-strain curve for PVC sticker in tension test; and ( d ) peel force for PVC sticker in peel test with peel angle and peel rate .…”
Section: Figure A1mentioning
confidence: 99%
“…Three samples are tested to give an average peel force . Referring to the equation given in [ 39 ], the work of adhesion per unit area is .…”
Conformal design of the island-bridge structure is the key to construct high-performance inorganic stretchable electronics that can be conformally transferred to non-developable surfaces. Former studies in conformal problems of epidermal electronics are mainly focused on soft surfaces that can adapt to the deformation of the electronics, which are not suitable for applications in hard, non-developable surfaces because of their loose surface constraints. In this paper, the conformal design problem for the island-bridge structure on a hard, non-developable surface was studied, including the critical size for island and stiffness and the demand for stretchability for the bridge. Firstly, the conformal model for an island on a part of torus surface was established to determine the relationship between the maximum size of the island and the curvatures of the surface. By combining the principle of energy minimization and the limit of material failure, a critical non-dimensional width for conformability was given for the island as a function of its thickness and interfacial adhesion energy, and the ratio of two principal curvatures of the surface. Then, the dependency of the tensile stiffness of the bridge on its geometric parameters was studied by finite element analysis (FEA) to guide the deterministic assembly of the islands on the surface. Finally, the location-dependent demands for the stretchability of the bridges were given by geometric mapping. This work will provide a design rule for stretchable electronics that fully conforms to the non-developable surface.
“…Flexible devices, such as flexible displays [1][2][3] and batteries [4][5][6], are drawing attention. For flexible devices, flexible materials such as polymers are used instead of conventional hard materials such as glasses.…”
In processes using the ultrashort pulsed laser, the phenomenon that the ablation efficiency is reduced due to the increase of the shielding effect of the generated plume is increasingly caused by the use of the high power and high repetition rate. A new method is needed to prevent a decrease in ablation efficiency in processing using an ultrashort pulsed laser. In this study, the proposed a processing method that can improve the ablation efficiency by providing an efficient escape path of plume, and examine the feasibility of a new processing method. The new method we proposed is a method of laser processing after generating a fine curvature in the polymer as a preliminary preparation. The fine curvature of the polymer produced by the preliminary preparation induces an artificial chimney-like opening along the path of the incident beam during laser processing, thereby enabling the plume to be effectively removed. The experiment for examine the feasibility through a new method was conducted using a 10-picosecond laser of UV wavelength with two optical systems. As a new processing method, when processing with ultrashort pulse laser, it was observed that the ablation efficiency improved.
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