Conjugate Forced Convection-Conduction Heat Transfer in Channel Flow Using Different Cooling Fluids

Nishida, Felipe Baptista; Tadano, Yara de Souza; Alves, Thiago Antonini

doi:10.1615/ihtc15.eec.009594

Cited by 3 publications

(3 citation statements)

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“…Due to the advent of the modern electronic technology, electronic device miniaturization and higher switching speeds created a significant demand for achieving high heat dissipation rates [1]. The failure factor of the electronic devices resulting from electromigration and oxide breakdown, in general, increase almost exponentially with the working temperature that should not exceed a value between 85 °C and 100 °C [2].…”

Section: Introductionmentioning

confidence: 99%

Thermal performance evaluation of different passive devices for electronics cooling

Krambeck¹,

Baptista²,

Marrone³

et al. 2019

THERM SCI

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The advent of modern electronic technology lead to miniaturization and high power density of electronic devices, then the existing electronic cooling techniques cannot be used, directly affecting the performance, cost, and reliability of electronic devices. Thus, the thermal management of electronic packaging has become a key technique in many products. Passive heat transfer devices can be a good alternative to the stabilization of electronic devices temperature. In this research, an experimental evaluation of the thermal performance of four different passive devices was accomplished. The considered devices were a rod, a thermosyphon, a heat pipe with a metal screen as the capillary structure, and a heat pipe with microgrooves. The heat pipe is a highly efficient device that carries large amounts of power with a small temperature difference. The heat pipe consists of the involucre, the working fluid, and the capillary structure. The thermosyphon is a kind of heat pipe assisted by gravity. In other words, it has no wick structure to return the working fluid. The devices were made of copper with a total length of 200 mm and an outer diameter of 9.45 mm. The thermosyphon and the heat pipes used deionized water as working fluid with a filling ratio of 60% of the evaporator volume. The devices were tested in vertical and horizontal positions under thermal loads between 5 W and 45 W. All the devices have operated satisfactorily when tested in accordance with the behavior of the thermal resistance. The heat pipes were the best among the tested devices and the best position was vertical.

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Section: Introductionmentioning

confidence: 99%

Thermal performance evaluation of different passive devices for electronics cooling

Krambeck¹,

Baptista²,

Marrone³

et al. 2019

THERM SCI

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“…The increase of computer system performance has resulted in a high heat generation. On the other hand, the computers' performance can be potentially reduced due to these high heat flux densities [2]. Therefore, the thermal management of this kind of electronic equipment has become a challenge in order to avoid the overheating and, as a consequence, the hardware failure [3].…”

Section: Introductionmentioning

confidence: 99%

Heat Pipe and Thermosyphon for Thermal Management of Thermoelectric Cooling

Alves¹,

Krambeck²,

dosSantos³

2018

Bringing Thermoelectricity Into Reality

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The heat pipe and thermosyphon are passive heat transfer devices with phase change, which can be applied for thermal management of thermoelectric cooling, such as the TEC hot side. The heat pipes basically consist of a metal tube sealed with capillary structure internally that is embedded with a working fluid. This capillary structure can be made of screen meshes, grooves, or sintered media. The thermosyphon is a heat pipe assisted by gravity, because it has no capillary structure. Then, in this chapter, manufacturing of low cost and easy-to-manufacture heat pipes and thermosyphon is described in detail, and an experimental evaluation of their thermal performance is accomplished. The considered devices were a rod, a thermosyphon, a mesh heat pipe, a grooved heat pipe, and a sintered heat pipe. According to the behavior of the global thermal resistance and the effective thermal conductivity, the passive devices operated satisfactorily with the exception of the rod and the thermosyphon in the horizontal position. The heat pipes were the best among the tested devices and the best position was vertical.

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“…In the last decades, academic researches and scientific-technological efforts were developed in order to enhance the cooling technologies of electronic equipment, since, with the innovation of the modern electronic technology, it became faster, smaller and incorporated more functions, resulting in a significant unavoidable increase in the volumetric heat generation rate. That is the case of smartphones, notebooks, tablets, and computers [1]. The failure factor of the electronic devices in general increase almost exponentially with the work temperature that should not exceed a value between 85 °C and 100 °C [2].…”

Section: Introductionmentioning

confidence: 99%

Application of Different Conductive Substrate Materials for Heat Transfer Enhancement in Cooling of Electronic Components

Alves

Barbur

Nishida

2014

AMR

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In this research, a study of the heat transfer enhancement in electronic components mounted in channels was conducted by using different materials in the conductive substrate. In this context, a numerical analysis was performed to investigate the cooling of 3D protruding heaters mounted on the bottom wall (substrate) of a horizontal rectangular channel using the ANSYS/FluentTM 15.0 software. Three different materials of the conductive substrate were analyzed, polymethyl methacrylate (PMMA), fiberglass reinforced epoxy laminate (FR4), and pure aluminum (Al). Uniform heat generation rate was considered for the protruding heaters and the cooling process happened through a steady laminar airflow, with constant properties. The fluid flow velocity and temperature profiles were uniform at the channel entrance. For the adiabatic substrate, the cooling process occurred exclusively by forced convection. For the conductive substrate, the cooling process was characterized by conjugate forced convection-conduction heat transfer through two mechanisms; one directly between the heaters surfaces and the flow by forced convection, and the other through conduction at the interfaces heater-substrate in addition to forced convection from the substrate to the fluid flow at the substrate surface. The governing equations and boundary conditions were numerically solved through a coupled procedure using the Control Volumes Method in a single domain comprising the solid and fluid regions. Commonly used properties in cooling of electronics components mounted in a PCB and typical geometry dimensions were utilized in the results acquisition. Some examples were presented, indicating the dependence of the substrate thermal conductivity related to the Reynolds number on the heat transfer enhancement. Thus, resulting in a lower work temperature at the electronic components.

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Conjugate Forced Convection-Conduction Heat Transfer in Channel Flow Using Different Cooling Fluids

Cited by 3 publications

References 0 publications

Thermal performance evaluation of different passive devices for electronics cooling

Thermal performance evaluation of different passive devices for electronics cooling

Heat Pipe and Thermosyphon for Thermal Management of Thermoelectric Cooling

Application of Different Conductive Substrate Materials for Heat Transfer Enhancement in Cooling of Electronic Components

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