Constitutive Relations for Creep in a SnCu-Based Composite Solder Reinforced with Ag Particles

Shi, Yaowu; Yan, Yanfu; Liu, Jianping; Xia, Zhidong; Liu, Yongping; Guo, Fu; Li, Xiaoyan

doi:10.1007/s11664-009-0840-1

Cited by 15 publications

(13 citation statements)

References 15 publications

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“…The stress exponent decreases with increasing temperature for both high and low stress ranges. This stress exponent finding is consistent with other researchers' results, such as those of He et al 23 for Sn-3.0Ag-0.5Cu-xBi solders, Shi et al 35 for 63Sn-37Pb solder, Shi et al 36 for Sn-0.7Cu solder, and Xiao et al 32 for Sn-3.9Ag-0.6Cu solder. …”

Section: Methodssupporting

confidence: 92%

“…Xiao et al 18 reported that adding a small amount of RE elements can increase the creep fatigue rupture lifetime of Sn-3.8Ag-0.7Cu solder joints. Shi et al 36 reported that the creep resistance of Ag-particlereinforced Sn-0.7Cu solder joints is superior to that of Sn-0.7Cu solder joints. Saad et al 33 reported that the addition of 1.5 wt.% Ag to Sn-8.8Zn solder alloy increases the creep resistance of the solder.…”

Section: Resultsmentioning

confidence: 99%

See 1 more Smart Citation

Creep Properties of Sn-1.0Ag-0.5Cu Lead-Free Solder with Ni Addition

Zhu²,

Poh³

et al. 2011

Journal of Elec Materi

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In this work, tensile creep tests for Sn-1.0Ag-0.5Cu-0.02Ni solder have been conducted at various temperatures and stress levels to determine its creep properties. The effects of stress level and temperature on creep strain rate were investigated. Creep constitutive models (such as the simple power-law model, hyperbolic sine model, double power-law model, and exponential model) have been reviewed, and the material constants of each model have been determined based on experimental results. The stress exponent and creep activation energy have been studied and compared with other researchers' results. These four creep constitutive models established in this paper were then implemented into a user-defined subroutine in the ANSYSä finite-element analysis software to investigate the creep behavior of Sn-1.0Ag-0.5Cu-0.02Ni solder joints of thin fine-pitch ball grid array (TFBGA) packages for the purpose of model comparison and application. Similar simulation results of creep strain and creep strain energy density were achieved when using the different creep constitutive models, indicating that the creep models are consistent and accurate.

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Section: Methodssupporting

confidence: 92%

Section: Resultsmentioning

confidence: 99%

Creep Properties of Sn-1.0Ag-0.5Cu Lead-Free Solder with Ni Addition

Zhu²,

Poh³

et al. 2011

Journal of Elec Materi

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“…% among the Ag particle-enhanced Sn-0.7Cu lead-free based composite solders (Shi et al, 2009). The best volume fraction and dimension of reinforcing particles are listed in Table I.…”

Section: Preparation Of Composite Soldersmentioning

confidence: 99%

“…Published literature comparing the creep behaviour of in situ Cu 6 Sn 5 -reinforced Sn-3.5Ag composite solder joints and noncomposite solder joints, found that the global steady-state creep strain rate was much lower and exhibited the best creep resistance in composite solder joints (McDougall et al, 2000; The current issue and full text archive of this journal is available at www.emeraldinsight.com/0954-0911.htm Lucas et al, 1999). The Sn-0.7Cu-based composite solder reinforced with micro-sized Ag particles possessed higher creep activation energy and stress exponent as compared to the Sn-0.7Cu solder, and exhibited excellent creep properties (Shi et al, 2009).…”

Section: Introductionmentioning

confidence: 99%

“…In our previous research, nano-sized Ag reinforcing particles were incorporated into a promising leadfree solder, Sn-0.7Cu, by mechanical means (Shi et al, 2009;Tai et al, 2005). Experimental results indicated that both the micro-and nano-sized Ag reinforcing particles can improve wettability, simple shear peak strengths and creep-rupture lives than Sn-0.7Cu solder.…”

Section: Introductionmentioning

confidence: 99%

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Creep properties of Sn‐0.7Cu composite solder joints reinforced with nano‐sized Ag particles

Tian

Guo

Liu

et al. 2010

Soldering &Amp; Surface Mount Technology

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2013),"SAC solder paste with carbon nanotubes. Part II: carbon nanotubes' effect on solder joints' mechanical properties and microstructure", Soldering & Surface Mount Technology, Vol. 25 Iss 4 pp. 195-208 http://dx.If you would like to write for this, or any other Emerald publication, then please use our Emerald for Authors service information about how to choose which publication to write for and submission guidelines are available for all. Please visit www.emeraldinsight.com/authors for more information. About Emerald www.emeraldinsight.comEmerald is a global publisher linking research and practice to the benefit of society. The company manages a portfolio of more than 290 journals and over 2,350 books and book series volumes, as well as providing an extensive range of online products and additional customer resources and services.Emerald is both COUNTER 4 and TRANSFER compliant. The organization is a partner of the Committee on Publication Ethics (COPE) and also works with Portico and the LOCKSS initiative for digital archive preservation. AbstractPurpose -The purpose of this paper is to investigate the creep properties of Sn-0.7Cu composite solder joints reinforced with optimal nano-sized Ag particles in order to improve the creep performance of lead-free solder joints by a composite approach. Design/methodology/approach -The composite approach has been considered as an effective method to improve the creep performance of solder joints. Nano-sized Ag reinforcing particles were incorporated into Sn-0.7Cu solder by mechanically mixing. A systematic creep study was carried out on nano-composite solder joints reinforced with optimal nano-sized Ag particles and compared with Sn-0.7Cu solder joints at different temperatures and stress levels. A steady-state creep constitutive equation for nano-composite solder joints containing the best volume reinforcement was established in this study. Microstructural features of solder joints were analyzed to help determine their deformation mechanisms during creep. Findings -The creep activation energies and stress exponents of Ag particle-enhanced Sn-0.7Cu lead-free based composite solder joints were higher than those of matrix solder joints under the same stress and temperature. Thus, the creep properties of nano-composite solder joints are better than those of Sn-0.7Cu solder joints. Originality/value -The findings indicated that nano-sized Ag reinforcing particles could effectively improve the creep properties of solder joints. A new steady-state creep constitutive equation of nano-composite solder joints was established. Deformation mechanisms of Sn-0.7Cu solder and nano-composite solder joints during creep were determined.

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Effect of nanosized graphite on properties of Sn–Bi solder

Yang

Dai

et al. 2013

J Mater Sci: Mater Electron

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Constitutive Relations for Creep in a SnCu-Based Composite Solder Reinforced with Ag Particles

Cited by 15 publications

References 15 publications

Creep Properties of Sn-1.0Ag-0.5Cu Lead-Free Solder with Ni Addition

Creep Properties of Sn-1.0Ag-0.5Cu Lead-Free Solder with Ni Addition

Creep properties of Sn‐0.7Cu composite solder joints reinforced with nano‐sized Ag particles

Effect of nanosized graphite on properties of Sn–Bi solder

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