Constructing single- and multiple-helical microcoils and characterizing their performance as components of microinductors and microelectromagnets

Rogers, John A.; Jackman, Rebecca J.; Whitesides, George M.

doi:10.1109/84.623106

Cited by 78 publications

(63 citation statements)

References 33 publications

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“…CP is a particularly promising method that has the potential for patterning large areas quickly. It was first described by Whitesides and Kumar (7) and has since been explored by us and others for constructing simple devices in the areas of lasers (11), fiber optics (12), inorganic microelectronics (13)(14)(15), microfluidic analytical chemistry (16), and biotechnology (17). We recently reported processing conditions that enable CP to be used for fabricating the source͞drain level in a variety of basic organic electronic devices (8,(18)(19)(20).…”

Section: Methodsmentioning

confidence: 99%

Paper-like electronic displays: Large-area rubber-stamped plastic sheets of electronics and microencapsulated electrophoretic inks

Rogers¹,

Bao²,

Baldwin³

et al. 2001

Proc. Natl. Acad. Sci. U.S.A.

1,107

674

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Electronic systems that use rugged lightweight plastics potentially offer attractive characteristics (low-cost processing, mechanical flexibility, large area coverage, etc.) that are not easily achieved with established silicon technologies. This paper summarizes work that demonstrates many of these characteristics in a realistic system: organic active matrix backplane circuits (256 transistors) for large (Ϸ5 ؋ 5-inch) mechanically flexible sheets of electronic paper, an emerging type of display. The success of this effort relies on new or improved processing techniques and materials for plastic electronics, including methods for (i) rubber stamping (microcontact printing) high-resolution (Ϸ1 m) circuits with low levels of defects and good registration over large areas, (ii) achieving low leakage with thin dielectrics deposited onto surfaces with relief, (iii) constructing highperformance organic transistors with bottom contact geometries, (iv) encapsulating these transistors, (v) depositing, in a repeatable way, organic semiconductors with uniform electrical characteristics over large areas, and (vi) low-temperature (Ϸ100°C) annealing to increase the on͞off ratios of the transistors and to improve the uniformity of their characteristics. The sophistication and flexibility of the patterning procedures, high level of integration on plastic substrates, large area coverage, and good performance of the transistors are all important features of this work. We successfully integrate these circuits with microencapsulated electrophoretic ''inks'' to form sheets of electronic paper.T he backplane circuit consists of a square array of 256 suitably interconnected p-channel transistors. Fig. 1 shows the circuit layout. Fig. 2 presents a cross-sectional illustration of a transistor and a top view of a unit cell. The completed display (total thickness Ϸ1 mm) comprises a transparent frontplane electrode of indium tin oxide (ITO) and a thin unpatterned layer of flexible electronic ''ink'' mounted against a sheet that supports square pixel electrode pads and pinouts; these pixel pads attach, via a conductive adhesive, to the back planes. Each transistor functions as a switch that locally controls the color of the ink, which consists of a layer of polymeric microcapsules filled with a suspension of charged pigments in a colored fluid (1, 2). In each of the four quadrants of the display, transistors in a given column have connected gates, and those in a given row have connected source electrodes. Applying a voltage to a column (gate) and a row (source) electrode turns on the transistor located at the cell where these electrodes intersect. Activating the transistor generates an electric field between the frontplane ITO and the corresponding pixel electrode. This field causes movement of a pigment within the microcapsules, which changes the color of the pixel, as observed through the ITO: when the pigments flow to the ITO side of the capsules, the color of the pigment (white in this case) determines the color of the pixel; when they ...

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Section: Methodsmentioning

confidence: 99%

Paper-like electronic displays: Large-area rubber-stamped plastic sheets of electronics and microencapsulated electrophoretic inks

Rogers¹,

Bao²,

Baldwin³

et al. 2001

Proc. Natl. Acad. Sci. U.S.A.

1,107

674

View full text Add to dashboard Cite

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“…Thus manipulation and diagnosis of short bunches and design of miniature magnets are important research problems. Meanwhile, fabrication of microelectromagnets with 0.4-T flux density, 100-µm diameter and sub-millisecond switching time has been demonstrated (81).…”

Section: Advanced Structure Conceptsmentioning

confidence: 99%

Ultimate gradient in solid-state accelerators

Whittum

1999

AIP Conference Proceedings

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We recall the motivation for research in high-gradient acceleration and the problems posed by a compact collider. We summarize the phenomena known to appear in operation of a solid-state structure with large fields, and research relevant to the question of the ultimate gradient. We take note of new concepts, and examine one in detail, a miniature particle accelerator based on an active millimeter-wave circuit and parallel particle beams. Baltimore, Maryland July 5-11, 1998 Work supported by U.S. Abstract. We recall the motivation for research in high-gradient acceleration and the problems posed by a compact collider. We summarize the phenomena known to appear in operation of a solid-state structure with large fields, and research relevant to the question of the ultimate gradient. We take note of new concepts, and examine one in detail, a miniature particle accelerator based on an active millimeter-wave circuit and parallel particle beams. Invited talk presented at the 8th Workshop on Advanced Accelerator Concepts

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“…Rogers et al [25] produced both single-and multiple-helical microcoils with printed wires that were 125 to 150 µm wide. They characterized the microcoils as components of microelectromagnets and microinductors.…”

Section: Background: Microcontact Printing Has Been Used In a Wide Vamentioning

confidence: 99%

“…Many groups have successfully transferred a wide variety of patterns to both 2-D [2-17] and 3-D [3,7,8,[18][19][20][21][22][23][24][25][26][27] substrates using microcontact printing. Some innovative 2-D applications resulted in a variety of end uses.…”

Section: Background: Microcontact Printing Has Been Used In a Wide Vamentioning

confidence: 99%

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Exploring the Feasibility of Fabricating Micron-Scale Components Using Microcontact Printing LDRD Final Report

Myers¹,

Ritchey²,

Stokes³

et al. 2003

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Many microfabrication techniques are being developed for applications in microelectronics, microsensors, and micro-optics. Since the advent of microcomponents, designers have been forced to modify their designs to include limitations of current technology, such as the inability to make three-dimensional structures and the need for piece-part assembly. Many groups have successfully transferred a wide variety of patterns to both two-dimensional and three-dimensional substrates using microcontact printing. Microcontact printing is a technique in which a self-assembled monolayer (SAM) is patterned onto a substrate by transfer printing. The patterned layer can act as an etch resist or a foundation upon which to build new types of microstructures. We created a gold pattern with features as small as 1.2 µm using microcontact printing and subsequent processing. This approach looks promising for constructing single-level structures such as microelectrode arrays and sensors. It can be a viable technique for creating three-dimensional structures such as microcoils and microsprings if the right equipment is available to achieve proper alignment, and if a means is available to connect the final parts to other components in subsequent assembly operations. Microcontact printing provides a wide variety of new opportunities in the fabrication of microcomponents, and increases the options of designers.4

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Constructing single- and multiple-helical microcoils and characterizing their performance as components of microinductors and microelectromagnets

Cited by 78 publications

References 33 publications

Paper-like electronic displays: Large-area rubber-stamped plastic sheets of electronics and microencapsulated electrophoretic inks

Paper-like electronic displays: Large-area rubber-stamped plastic sheets of electronics and microencapsulated electrophoretic inks

Ultimate gradient in solid-state accelerators

Exploring the Feasibility of Fabricating Micron-Scale Components Using Microcontact Printing LDRD Final Report

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