2006
DOI: 10.1016/j.mssp.2006.01.077
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Contact-free defect investigation of wafer-annealed Fe-doped SI-InP

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Cited by 4 publications
(3 citation statements)
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“…Investigations on indium phosphide show that the defect content changes during annealing processes, which may also have an impact on the distribution of electrical properties. Whereas the defect content of as‐grown samples depends on their position in the crystal, an equivalent set of defect levels is prominent in wafer‐annealed samples 22. Figure 10 shows a comparison of Fe‐doped SI‐InP samples from different crystal positions.…”
Section: Resultsmentioning
confidence: 99%
See 1 more Smart Citation
“…Investigations on indium phosphide show that the defect content changes during annealing processes, which may also have an impact on the distribution of electrical properties. Whereas the defect content of as‐grown samples depends on their position in the crystal, an equivalent set of defect levels is prominent in wafer‐annealed samples 22. Figure 10 shows a comparison of Fe‐doped SI‐InP samples from different crystal positions.…”
Section: Resultsmentioning
confidence: 99%
“… Comparison of MD‐PICTS spectra of as‐grown Fe‐doped SI‐InP samples from different crystal positions and thus different Fe‐concentrations. The samples differ in their characteristic defect levels 22. …”
Section: Resultsmentioning
confidence: 99%
“…MDP is a novel technique, which is used for inline applications as well as defect investigations [1][2][3]. The sample is excited with a rectangular laser pulse and the photoconductivity is measured via microwave absorption.…”
Section: Experimental Techniquementioning
confidence: 99%