Abstract:Industry consolidation in semiconductor manufacturing, driven by commoditization and decreasing margins, is placing ever increasing pressure on fab productivity. Concomitant technology innovation, shrinking device geometries, the transition to non-planar transistors and novel device structures (such as CIS or IGBT) make yield attainment increasingly challenging. The defect level performance of semiconductor manufacturing equipment, in particular in ion implantation, is one of the critical parameters contributi… Show more
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