Two-dimensional heterostructures
with tremendous electronic and
optoelectronic properties hold great promise for nanodevice integrations
and applications owing to the wide tunable characteristics. Toward
this end, developing construction strategies in allusion to large-scale
production of high-quality heterostructures is critical. The mainstream
preparation routes are representatively classified into two categories
of top-down and bottom-up approaches. Nonetheless, the relatively
low reproductivity and the limitation for lateral heterostructure
formations of top-down methods at the present stage inherently impeded
their further developments. To surmount these obstacles, assembling
heterostructures via miscellaneous bottom-up preparation
protocols has emerged as a potential solution, attributed to the controllability
and clean interface. Three typical approaches of chemical/physical
vapor deposition, solution synthesis, and growth under ultrahigh vacuum
conditions have shown promise due to the possibilities for preparing
heterostructures with predesigned structures, clean interfaces, and
the like. Therefore, bottom-up preparation engineering of heterostructures
in two dimensions for further device applications is of vital importance.
Moreover, heterostructure integrations by these methods have experienced
a period of flourishing development in the past few years. In this
review, the classical bottom-up growth routes, characterization methods,
and latest progress of diverse heterostructures and further device
applications are overviewed. Finally, the challenges and opportunities
are discussed.