“…Additionally, Cu 2− x Te can further potentially generate multiscale nano-defects, including dislocations and ordered/disordered Cu vacancies. (iii) The beneficial effects of copper-containing compounds have been extensively demonstrated in various TE materials, such as SnSe, 37 PbTe, 38 GeTe, 39 and half-Heusler alloys, 40 and compared to other additives, its most notable characteristic is the minimal adverse impact on carrier mobility. Based on a process combining BM-SPS, the substitution of Cu and Sn for Bi/Sb, leading to the injection of hole concentration ( p H ) and an augmentation in the density-of-states effective mass
, in turn facilitates a net increase in the weighted mobility ( μ W ) and the corresponding power factor ( S 2 σ , PF).…”