2007
DOI: 10.1016/j.cap.2006.09.028
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Control of surfaces and heterointerfaces of AlGaN/GaN system for sensor devices and their on-chip integration on nanostructures

Abstract: For successful construction of sensor devices and their future on-chip integration on nanostructures, this paper discusses the present status of understanding and control of surfaces and heterointerfaces of the AlGaN/GaN material system by reviewing a series of works recently carried out by the authors'group.

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Cited by 15 publications
(9 citation statements)
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References 49 publications
(52 reference statements)
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“…The Schottky barrier heights are much more dependent on the metal work function than those for other III−V materials, indicating a weaker Fermi level pinning. However, Schottky diodes formed on GaN and AlGaN materials exhibit excess reverse leakage currents, which are many orders of magnitude larger than the prediction of the standard thermionic emission model (see section 3.2.2).…”
Section: 14 Gan and Algan Based Schottky Diodesmentioning
confidence: 88%
See 1 more Smart Citation
“…The Schottky barrier heights are much more dependent on the metal work function than those for other III−V materials, indicating a weaker Fermi level pinning. However, Schottky diodes formed on GaN and AlGaN materials exhibit excess reverse leakage currents, which are many orders of magnitude larger than the prediction of the standard thermionic emission model (see section 3.2.2).…”
Section: 14 Gan and Algan Based Schottky Diodesmentioning
confidence: 88%
“…160 Therefore, the elimination of oxygen from AlGaN and GaN layers is highly desirable prior to the sensor fabrication in order to realize high-performance sensors, e.g., by using an ultrathin Al layer as a getter material for oxygen. 157 Schottky diodes on AlGaN/GaN heterostructures with Pt, IrPt, and PdAg catalytic metals have been fabricated and characterized from 200 to 800 °C for hydrogen sensing operation. 161 The hydrogen sensitivity of Pt and IrPt diodes improves with the increase in temperature due to a more effective hydrogen dissociation.…”
Section: Gan and Algan Based Schottky Diodesmentioning
confidence: 99%
“…The material itself is found as environmentfriendly and bio-friendly. Furthermore, the GaN material allows sensing operations at high temperatures due to large bandgap energies [2]. In future, realization of wireless sensor chips by onchip co-integration of circuits for sensor signal processing and wireless communications also will be possible with the HFET technology.…”
mentioning
confidence: 99%
“…En cualquier caso, la superficie de las heteroestructuras de AlGaN/GaN es realmente importante y está fuertemente relacionada con inestabilidades del rendimiento, como el colapso de corriente, en diferentes aplicaciones [Has07] y como se mencionó en la pág. 59, la presencia de "estados" en la superficie puede ser consecuencia de variaciones en la densidad de portadores en la intercara del AlGaN/GaN.…”
Section: Con Tratamientounclassified
“…Frecuentemente, la modificación de la superficie se señala como clave en las variaciones de la densidad del 2DEG en las heteroestructura HEMT y, en definitiva, un control preciso de la superficie es unos de los retos para mejorar la fiabilidad de los dispositivos HEMT [Has07]. En la relacionaron variaciones en el estado de deformación en el plano para el GaN con los diferentes rangos medidos para la resistencia de hoja, en obleas de AlGaN/GaN crecidas sobre zafiro [Mah08-1].…”
Section: Variación Del Estado De Deformación Y De La Densidad De Carg...unclassified