2011
DOI: 10.1016/j.tsf.2011.01.070
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Control of the damage resistance of nanocomposite TiSiN coatings on steels: Roles of residual stress

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Cited by 38 publications
(8 citation statements)
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“…A nanoindentation workstation (Ultra-Micro Indentation System 2000, CSIRO, Sydney, Australia) equipped with a Berkovich indenter [25,26] was used to determine the mechanical properties of the films. To ensure that only the film properties were measured, nanoindentation was conducted under load control with a maximum load of 0.5 mN, under which the maximum penetration depth was found to be ~0.1 m (see Results and discussion section), well below 10% of the total film thickness of ~2 m.…”
Section: Characterizationsmentioning
confidence: 99%
“…A nanoindentation workstation (Ultra-Micro Indentation System 2000, CSIRO, Sydney, Australia) equipped with a Berkovich indenter [25,26] was used to determine the mechanical properties of the films. To ensure that only the film properties were measured, nanoindentation was conducted under load control with a maximum load of 0.5 mN, under which the maximum penetration depth was found to be ~0.1 m (see Results and discussion section), well below 10% of the total film thickness of ~2 m.…”
Section: Characterizationsmentioning
confidence: 99%
“…The residual stresses which commonly exist in thin lms arise, in part, as a result of constraints imposed by their substrates. 29,30 In this case, the origin of residual stresses is mainly attributed to the large thermal expansion anisotropy of Ti 5 Si 3 and thermal expansion mismatch that exists between the lm and substrate. Similar to other non-cubic silicides with a chain-like structure, polycrystalline Ti 5 Si 3 exhibits a strong coefficient of thermal expansion (CTE) anisotropy between the c-and a-directions, which introduces thermal residual microstresses in the grains during cooling following the deposition process.…”
Section: Phase and Microstructure Characterizationmentioning
confidence: 99%
“…PVD techniques involving arc deposition are preferred to sputtering techniques because of the high deposition rate and the bond strength of the former [40]. The reduced bond strength in the latter is due to the high residual compressive stresses in the coated substrate resulting from its ionic bombardment during deposition [165,169].…”
Section: Methods Of Coating Depositionmentioning
confidence: 99%