2018
DOI: 10.1016/j.optlaseng.2017.10.012
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Controllable laser thermal cleavage of sapphire wafers

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Cited by 21 publications
(8 citation statements)
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“…In some cases, the laser irradiation itself provides enough thermal stress to cause the cutting of the sample. Such cutting process is referred to as thermal cleavage [19]. The focused laser spot acts, indeed, as a localized heat source generating a thermo-mechanical compressive stress, whose relaxation causes the material to separate along the laser scanning path [20].…”
Section: Introductionmentioning
confidence: 99%
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“…In some cases, the laser irradiation itself provides enough thermal stress to cause the cutting of the sample. Such cutting process is referred to as thermal cleavage [19]. The focused laser spot acts, indeed, as a localized heat source generating a thermo-mechanical compressive stress, whose relaxation causes the material to separate along the laser scanning path [20].…”
Section: Introductionmentioning
confidence: 99%
“…After being optimized in order to control the path of the stress-induced fracture, such a technique has been successfully applied to cut various materials, including silicon [21], alumina ceramics [22] and glass [23]. Xu et al [19] demonstrated the laser thermal cleavage of sapphire substrate wafers using a CO 2 laser source. Here, a groove was engraved by laser ablation on the substrate surface.…”
Section: Introductionmentioning
confidence: 99%
“…Xu et al controlled the thermal cleavage of sapphire wafers using laser irradiation [27]. A CO2 laser with a wavelength of 10.6 m was employed.…”
Section: Co2 Laser Thermal Crackingmentioning
confidence: 99%
“…Figure 2.6 Optical images of sapphire after controllable laser thermal cleavage of (a) surface and (b) cross section[27] …”
mentioning
confidence: 99%
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