The atomic layer deposition (ALD) of HfO 2 and ZrO 2 thin films is investigated using (MeCp) 2 HfMe 2 , (MeCp) 2 Hf(OMe)(Me), (MeCp) 2 ZrMe 2 , and (MeCp) 2 Zr(OMe)(Me) as the precursors at deposition temperatures between 300 and 500 -C, with water vapor as the oxygen source. A self-limiting growth mechanism is confirmed at 350 -C for all the metal precursors examined. The processes provide nearly stoichiometric HfO 2 and ZrO 2 films with carbon and hydrogen concentrations below 0.5 and 1.0 at.-%, respectively, for representative samples. All films are polycrystalline as deposited, and possess a thin interfacial SiO 2 layer. The capacitance-voltage (C-V) and current density-voltage (I-V) behavior is reported and discussed for capacitor structures containing films from this study.