2020
DOI: 10.1016/j.jcrysgro.2020.125683
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Controlled growth of MoS2 by atomic layer deposition on patterned gold pads

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Cited by 11 publications
(8 citation statements)
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“…[118] However, this approach might suffer from difficulties in defect-free passivation similar to most of the existing area-selective ALD processes, [120,121] and would ideally still require hindering of vertical growth. Recently, first investigations into area-selective ALD of TMDCs based on both inherent material selectivity [122][123][124] and area-selective passivation [121,125] have been reported, although these studies have not focused on increasing the grain size. Nevertheless, it is clear that controlling nucleation and diffusion is a powerful approach to tailor growth of ALD TMDCs that should be further examined.…”
Section: Specialties In the Atomic Layer Deposition Of 2d Materialsmentioning
confidence: 99%
“…[118] However, this approach might suffer from difficulties in defect-free passivation similar to most of the existing area-selective ALD processes, [120,121] and would ideally still require hindering of vertical growth. Recently, first investigations into area-selective ALD of TMDCs based on both inherent material selectivity [122][123][124] and area-selective passivation [121,125] have been reported, although these studies have not focused on increasing the grain size. Nevertheless, it is clear that controlling nucleation and diffusion is a powerful approach to tailor growth of ALD TMDCs that should be further examined.…”
Section: Specialties In the Atomic Layer Deposition Of 2d Materialsmentioning
confidence: 99%
“…However, in recent years, many research groups have been actively developing various deposition methods for producing wafer‐scale MoS 2 films for practical applications. Among these deposition methods, the ALD process using various Mo precursors [ 11–28 ] is attractive because it comprises alternating precursor injections, and thus, the adsorption characteristics of each precursor can be independently controlled.…”
Section: Figurementioning
confidence: 99%
“…However, top‐down patterning processes are expensive, leading to high manufacturing cost; thus, a bottom‐up patterning scheme based on the selective deposition of TMDC films on a designated (predefined) region is of great interest. [ 28–34 ] Typically, area‐selective film deposition can be achieved by controlling the chemical reaction of the introduced precursor with a surface designed so that it either promotes or inhibits film growth depending on the implementation approach. For example, in the case of area‐selective MoS 2 deposition, the regions requiring MoS 2 growth are predefined with a MoO 3 [ 29,30 ] or an Au layer [ 28 ] or are pretreated using O 2 plasma.…”
Section: Figurementioning
confidence: 99%
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“…The chemical reaction of the newly fabricated atomic film is directly determined by the previous layer, so only one layer of atoms can be deposited per ALD cycle [ 28 ]. During the ALD process, not only the thickness of the film can be precisely controlled, but the uniformity of the film on the substrate with complex morphology can also be well maintained [ 29 ]. In addition, because the manufacturing process is not sensitive to the amount of precursor, ALD has high repeatability.…”
Section: Introductionmentioning
confidence: 99%