A dual-curing dimethacrylate/epoxy resin system was found
to retain
printed resolution after photocuring by digital light processing three-dimensional
(3D) printing, and after a subsequent heating step, it had a glass
transition temperature of up to 140 °C. Postprinting curing conditions
were shown to influence the morphology of the fully cured structure,
depending on the rate of epoxy polymerization by dynamic mechanical
analysis (DMA). Curing of the epoxy component by heating to 180 °C
immediately after UV exposure created a partially miscible, phase-separated
structure, while delayed curing (dark curing at ambient temperature
for long times, up to 5 weeks) resulted in a single, broad tan δ
peak in DMA, indicating a miscible network system with no macroscale
phase separation. This dispersion of the epoxy–amine monomers
into the photopolymerized dimethacrylate polymer over long times is
surprising and is attributed to lower critical solution temperature
behavior of these two polymer systems. The resulting phase structure
of the sequential interpenetrating polymer network was found to influence
the thermal and mechanical properties of the finished 3D-printed article.