2023
DOI: 10.1002/admt.202201900
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Copper Composites and Laser Sintering: Novel Hybridization Method for 3D Printed Electronics

Abstract: Additive manufacturing of electronic devices is challenging because plastics and metals, which are both required as insulator and conductor, respectively, have very distinct thermal properties. Despite significant research efforts, the currently available electronic-printing methods are still limited by low printing speeds and high manufacturing costs. In this work, a hybrid printing method is proposed that combines fused deposition modeling (FDM) with laser sintering to print thermoplastics and copper in a si… Show more

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