Copper conductive patterns through spray-pyrolysis of copper-diethanolamine complex solution

Abstract

A simple and low-cost method to fabricate copper conductive patterns at low temperature is critical for printed electronics. Low-temperature spray-pyrolysis of copper-alkanolamine complex solution shows high potential for this application. However, the produced copper patterns exhibit a granular structure consisting of connected fine copper particles. In this work, low-temperature spray-pyrolysis of copper formate-diethanolamine complex solution under N2 flow at a temperature of 200 °C was investigated. The effects of spraying conditions on microstructure and electrical properties of the patterns were examined. Our results revealed that the spraying rate is a critical parameter determining the degree of sintering and electrical resistivity of the patterns. A low spraying rate facilitates sintering, and hence well-sintered copper patterns with the lowest resistivity of 6.12 μΩ.cm (3.6 times of bulk copper) on a polyimide substrate could be fabricated.

Mechanistic Insight into Bis(amino) Copper Formate Thermochemistry for Conductive Molecular Ink Design

“…Many of the advantages of these inks are derived from their molecular nature, and thus molecular tailoring of the amine ligand may be used to improve the stability and printability of the ink. For instance, the basicity, degree of steric hindrance, molecular weight, and stoichiometry of amine ligands bound to copper formate have been shown to govern the copper particle sizes, film morphologies, and porosity that ultimately determine the electrical properties of the copper films. − …”