Copper effects in mechanical, thermal and electrical properties of rapidly solidified eutectic Sn–Ag alloy

Gumaan, Mohammed S.; Shalaby, Rizk Mostafa; Ali, Esmail Abdo Mohammed; Kamal, Mustafa

doi:10.1007/s10854-018-8906-6

Cited by 24 publications

(15 citation statements)

References 23 publications

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“…The addition of 0.1, 0.3, 0.5 and 0.7 Wt.% of Cr promoted the Ag 3 Sn IMC peaks (in different orientations) by 100 per cent, compared with the eutectic Sn-Ag alloy. In addition, the Ag atoms tended to react much more strongly with Sn than Cr to form the high melting point intermetallic compound, Ag 3 Sn, than that of any other compound (Gumaan et al, 2018). The details of the XRD analysis are shown in Table I.…”

Section: Structural Analysismentioning

confidence: 99%

“…The mechanical and thermal properties of the eutectic Sn-Ag alloy have been affected by Cu additions, because of the strong interaction of the solder components along with dissolved Cu atoms (Nadia and Haseeb, 2012). From the facts above, it was concluded that the physical performances of rapidly solidified eutectic Sn-Ag alloys with Cu additions at different concentrations were much better than for Sb additions (Gumaan et al, 2018;Shalaby et al, 2018;Gumaan et al, 2016a). Fornaro and Morando (2018) concluded that the Ag 3 Sn and Cu 6 Sn 5 intermetallic phases formed in the Sn-Ag alloy due to Cu additions, showed limited solubility into the Sn-rich phase (Fornaro and Morando, 2018;Gumaan et al, 2019).…”

Section: Introductionmentioning

confidence: 99%

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Chromium effects on the microstructural, mechanical and thermal properties of a rapidly solidified eutectic Sn-Ag alloy

Abbas

Gumaan

Shalaby

2019

SSMT

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Purpose This study aims to investigate the chromium (Cr) effects on the microstructural, mechanical and thermal properties of melt-spun Sn-3.5Ag alloy. Design/methodology/approach Ternary melt-spun Sn-Ag-Cr alloys were investigated using X-ray diffractions, scanning electron microscope, dynamic resonance technique, instron machine, Vickers hardness tester and differential scanning calorimetry. Findings The results revealed that the Ag3Sn intermetallic compound (IMC) and ß-Sn have been refined because of the hard inclusions’ (Cr atoms) effects, causing lattice distortion increasing these alloys. The tensile results of Sn96.4-Ag3.5-Cr0.1 alloy showed an improvement in Young’s modulus more than 100 per cent (42.16 GPa), ultimate tensile strength (UTS) by 9.4 per cent (23.9 MPa), compared with the eutectic Sn-Ag alloy due to the high concentration of Ag3Sn and their uniform distribution. Shortage in the internal friction (Q−1) of about 54 per cent (45.1) and increase in Vickers hardness of about 7.4 per cent (142.1 MPa) were also noted. Hexagonal Ag3Sn formation led to low toughness values compared to the eutectic Sn-Ag alloy, which may have resulted from the mismatching among hexagonal Ag3Sn phase with orthorhombic Ag3Sn and ß-Sn phases. Mechanically, the values of Young’s modulus have been increased, with increasing chromium content, whereas the UTS and toughness values have been decreased. The opposite of this trend appeared in Sn95.8-Ag3.5-Cr0.7 alloy, which may have been due to high lattice distortion (ƹ = 16.5 × 10−4) compared to the other alloys. Increase in the melting temperature Tm, ΔH, Cp and ΔT was because of Ag3Sn IMC formation. The low toughness of Sn96-Ag3.5-Cr0.5 and Sn95.8-Ag3.5-Cr0.7 (109.56 J/m3 and 35.66 J/m3), relatively high melting temperature Tm (223.22°C and 222.65°C) and low thermal conductivity and thermal diffusivity (32.651 w.m−1.k−1 and 0.314 m2/s) make them undesirable in the soldering process. The high UTS, high E, high thermal conductivity and diffusivity, low creep rate and low electrical resistivity, which have occurred with “0.1 Wt.%” of Cr, make this alloy desirable and reliable for soldering applications and electronic assembly. Originality/value This study provides chromium effects on the structure of the eutectic Sn-Ag rapidly solidified by melt-spinning technique. In this paper, the authors compared the elastic modulus of the melt-spun compositions, which have been resulted from the Static method with that have been resulted from the Dynamic method. This paper presents new improvements in mechanical and thermal performance.

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Section: Structural Analysismentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Chromium effects on the microstructural, mechanical and thermal properties of a rapidly solidified eutectic Sn-Ag alloy

Abbas

Gumaan

Shalaby

2019

SSMT

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“…Lead-free solder must be researched to replace the traditional Sn-Pb solder. The most widely researched lead-free solder systems include Sn-Ag [ 3 , 4 , 5 ], Sn-Cu [ 6 , 7 , 8 ], Sn-Bi [ 9 , 10 , 11 ], and Sn-Zn [ 12 , 13 , 14 , 15 ] binary alloys and Sn-Ag-Cu [ 16 , 17 ], Sn-Zn-Al [ 18 ], Sn-Zn-Bi [ 19 ], and Sn-Zn-Ag [ 20 ] ternary alloys. The Sn-9Zn (198 °C) eutectic solder has become one of the most advantageous candidates, not only because of its excellent mechanical properties and close melting point to Sn-37Pb (183 °C), but also its rich reserves of Zn elements, low production cost, and nontoxicity.…”

Section: Introductionmentioning

confidence: 99%

Effects of Yttrium Addition on the Microstructure Evolution and Electrochemical Corrosion of SN-9Zn Lead-Free Solders Alloy

Yang

Mao

et al. 2021

Materials

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Electrochemical corrosion behavior of ternary tin-zinc-yttrium (Sn-9Zn-xY) solder alloys were investigated in aerated 3.5 wt.% NaCl solution using potentiodynamic polarization techniques, and the microstructure evolution was obtained by scanning electron microscope (SEM). Eight different compositions of Sn-9Zn-xY (x = 0, 0.02, 0.04, 0.06, 0.08, 0.10, 0.20, and 0.30 wt.%) were compared by melting. The experimental results show that when the content of Y reached 0.06 wt.%, the grain size of Zn-rich phase became the smallest and the effect of grain refinement was the best, but there was no significant effect on the melting point. With the increases of Y content, the spreading ratio first increased and then decreased. When the content of Y was 0.06 wt.%, the Sn-9Zn-0.06Y solder alloy had the best wettability on the Cu substrate, which was increased by approximately 20% compared with Sn-9Zn. Besides, the electrochemical corrosion experimental shows that the Y can improve the corrosion resistance of Sn-9Zn system in 3.5 wt.% NaCl solution, and the corrosion resistance of the alloy is better when the amount of Y added is larger within 0.02–0.30 wt.%. Overall considering all performances, the optimal performance can be obtained when the addition amount of Y is 0.06.

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“…Most of the previous studies performed on these SAC alloys focused on the thermal, mechanical and microstructural properties of the solders and its solder joint structures formation (Shalaby et al , 2018). The electrical properties of these soldered structures are tremendously important and need to be deeply understood as there are phenomena that can lead to a local temperature increase of the material because of the electric current passing through it (Peltier effect) (Gumaan et al , 2018). Although it is known that various types of defects in soldered joints originate from local temperature gradients, there are few scientific studies in this area.…”

Section: Introductionmentioning

confidence: 99%

The effect of Bi addition on the electrical and microstructural properties of SAC405 soldered structure

Soares

Sarmento

Barros

et al. 2020

SSMT

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Purpose This study aims to investigate the effect of bismuth addition (up to 30 Wt%) on the microstructure and electrical conductivity of a commercial lead-free alloy (SAC405) near the solder/substrate soldered joint. The system under study is referred in this work as (SAC405 + xBi)/Cu, as Cu is the selected substrate in which the solder was casted. The electrical resistivity of this system was investigated, considering Bi addition effect on the local microstructure and chemical composition gradients within that zone. Design/methodology/approach Solder joints between Cu substrate and SAC405 alloy with different levels of Bi were produced. The electrical conductivity along the obtained solder/substrate interface was measured by four-point probe method. The microstructure and chemical compositions were evaluated by scanning electron microscopy/energy dispersive spectroscopy analysis. Findings Two different electrical resistivity zones were identified within the solder interface copper substrate/solder alloy. At the first zone (from intermetallic compound [IMC] until approximately 100 μm) the increase of the electrical resistivity is gradual from the substrate to the solder side. This is because of the copper substrate diffusion, which established a chemical composition gradient near the IMC layer. At the second zone, electrical resistivity becomes much higher and is mainly dependent on the Bi content of the solder alloy. In both identified zones, electrical resistivity is affected by its microstructure, which is dependent on Cu and Bi content and solidification characteristics. Originality/value A detailed characterization of the solder/substrate zone, in terms of electrical conductivity, was done with the definition of two variation zones. With this knowledge, a better definition of processing parameters and in-service soldered electronic devices behavior can be achieved.

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Copper effects in mechanical, thermal and electrical properties of rapidly solidified eutectic Sn–Ag alloy

Cited by 24 publications

References 23 publications

Chromium effects on the microstructural, mechanical and thermal properties of a rapidly solidified eutectic Sn-Ag alloy

Chromium effects on the microstructural, mechanical and thermal properties of a rapidly solidified eutectic Sn-Ag alloy

Effects of Yttrium Addition on the Microstructure Evolution and Electrochemical Corrosion of SN-9Zn Lead-Free Solders Alloy

The effect of Bi addition on the electrical and microstructural properties of SAC405 soldered structure

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