Copper-incorporated dendritic mesoporous silica nanospheres and enhanced chemical mechanical polishing (CMP) performance via Cu2+/H2O2 heterogeneous Fenton-like system

Chen, Yang; Wei, Aoli; Ma, Xiangyu; Wang, Tianyu; Chen, Ailian

doi:10.1016/j.apsusc.2022.154262

Cited by 21 publications

(2 citation statements)

References 69 publications

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“…The surface quality of polished silicon wafers after polishing with CTAB-SiO2, CTAC-SiO2, STAB-SiO2 and HDBAC-SiO2 particles can be investigated through their surface topographies, which were achieved by AFM optical microscope. As shown in Figure 7, the AFM micrographs reveal that flat and smooth surfaces without distinct scratches residual particles are achieved by using the asobtained composite particles as abrasives [36,37]. The scratches as well as other microdefects could hardly be observed [38,39].…”

Section: Polishing Performance Of Sio2 Microspherementioning

confidence: 84%

Facile Synthesis Monodisperse SiO<sub>2</sub> Sphere And Their Application Performances in Chemical Mechanical Polishing

Ge,

Liu,

Jin

et al. 2023

Preprint

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The chemical mechanical polishing (CMP) has been widely used for surface modification of critical materials and components and provided global planarization of topography with a low post-planarization slope high quality and efficiency. The colloidal silica slurries play an important role in the finishing processes of optical components. Monodisperse mesoporous silica nanospheres were synthesized with different surfactant by Stöber method. Their architectural features and texture parameters were characterized by XRD, FTIR, N2 adsorption–desorption isotherms, SEM, XPS, and TGA techniques. The spherical SiO2 products presented with the controllable 50-150 nm particle size and distribution. The AFM micrographs reveal that flat and smooth surfaces without distinct scratches residual particles are achieved by using the as-obtained composite particles as abrasives[The particle size of SiO2 slurry plays a critical role in the chemical-mechanical polishing process.

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Section: Polishing Performance Of Sio2 Microspherementioning

confidence: 84%

Facile Synthesis Monodisperse SiO<sub>2</sub> Sphere And Their Application Performances in Chemical Mechanical Polishing

Ge,

Liu,

Jin

et al. 2023

Preprint

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“…Initially, Cu 2+ ions undergo reduction by H 2 O 2 to generate Cu + , which subsequently engages in the Fenton-like reaction with H 2 O 2 . This reaction leads to the production of • OH and Cu 2+ , instigating oxidative stress responses. ,, Disruption of the cellular oxidative stress tends to induce bacterial death through DNA damage, protein oxidation, and lipid peroxidation, ultimately resulting in bacterial apoptosis and suppression of biofilm formation.…”

Section: Resultsmentioning

confidence: 99%

Sulfated Chitosan-Modified CuS Nanocluster: A Versatile Nanoformulation for Simultaneous Antibacterial and Bone Regenerative Therapy in Periodontitis

Chen,

Huang,

Wang

et al. 2024

ACS Nano

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Periodontitis, a prevalent chronic inflammatory disease worldwide, is triggered by periodontopathogenic bacteria, resulting in the progressive destruction of periodontal tissue, particularly the alveolar bone. To effectively address periodontitis, this study proposed a nanoformulation known as CuS@MSN-SCS. This formulation involves coating citrate-grafted copper sulfide (CuS) nanoparticles with mesoporous silica (MSNs), followed by surface modification using amino groups and sulfated chitosan (SCS) through electrostatic interactions. The objective of this formulation is to achieve efficient bacteria removal by inducing ROS signaling pathways mediated by Cu 2+ ions. Additionally, it aims to promote alveolar bone regeneration through Cu 2+ -induced pro-angiogenesis and SCS-mediated bone regeneration. As anticipated, by regulating the surface charges, the negatively charged CuS nanoparticles capped with sodium citrate were successfully coated with MSNs, and the subsequent introduction of amine groups using (3-aminopropyl)triethoxysilane was followed by the incorporation of SCS through electrostatic interactions, resulting in the formation of CuS@MSN-SCS. The developed nanoformulation was verified to not only significantly exacerbate the oxidative stress of Fusobacterium nucleatum, thereby suppressing bacteria growth and biofilm formation in vitro, but also effectively alleviate the inflammatory response and promote alveolar bone regeneration without evident biotoxicity in an in vivo rat periodontitis model. These findings contribute to the therapeutic effect on periodontitis. Overall, this study successfully developed a nanoformulation for combating bacteria and facilitating alveolar bone regeneration, demonstrating the promising potential for clinical treatment of periodontitis.

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Molybdenum-Containing Dendritic Mesoporous Silica Nanospheres as Effective Catalysts for Synthesis of Propylene Glycol Methyl Ether Acetate

Wang

Shao

et al. 2023

Catal Lett

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Copper-incorporated dendritic mesoporous silica nanospheres and enhanced chemical mechanical polishing (CMP) performance via Cu2+/H2O2 heterogeneous Fenton-like system

Cited by 21 publications

References 69 publications

Facile Synthesis Monodisperse SiO<sub>2</sub> Sphere And Their Application Performances in Chemical Mechanical Polishing

Facile Synthesis Monodisperse SiO<sub>2</sub> Sphere And Their Application Performances in Chemical Mechanical Polishing

Sulfated Chitosan-Modified CuS Nanocluster: A Versatile Nanoformulation for Simultaneous Antibacterial and Bone Regenerative Therapy in Periodontitis

Molybdenum-Containing Dendritic Mesoporous Silica Nanospheres as Effective Catalysts for Synthesis of Propylene Glycol Methyl Ether Acetate

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