Copper-Manganese Interdiffusion Kinetics Studied by X-Ray Microprobe

Interdiffusion coefficient, D, in Cu-Mn alloys has been determined by Matano's method in the temperature range between 1021 and 1203 K with the various couples consisting of pure copper and Cu-Mn alloys. It has been found that D increases with manganese content up to 30 at% Mn and decreases remarkably with a further increase of manganese. The concentration dependence of both the activation energy and the frequency factor for interdiffusion shows a small peak at 20 at % Mn and a very large peak at 80 at % Mn; the former is attributed to the increase in rigidity of the alloy and the latter to the deviation of the alloy from the ideal solid solution. The Kirkendall marker has been found to move toward the manganese-rich side where the Kirkendall void has been observed, indicating that the manganese atom diffuses faster than the copper atom. From the interdiffusion coefficient and velocity of the marker, the intrinsic diffusion coefficients, DMn and DCu, in 29 and 77 at %Mn alloys have been determined, and it has been shown that the ratio of DMn/DCu takes the value between 1.5 and 2.9.

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Interdiffusion in Cu–Mn Alloys

Iijima

Hirano

Sato

1977

Trans. JIM

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Copper-Manganese Interdiffusion Kinetics Studied by X-Ray Microprobe

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Interdiffusion in Cu–Mn Alloys

Interdiffusion in Cu–Mn Alloys

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Copper-Manganese Interdiffusion Kinetics Studied by X-Ray Microprobe

Cited by 1 publication

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Interdiffusion in Cu&ndash;Mn Alloys

Interdiffusion in Cu&ndash;Mn Alloys

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Interdiffusion in Cu–Mn Alloys

Interdiffusion in Cu–Mn Alloys