Copper thin films by ion beam assisted deposition: Strong texture, superior thermal stability and enhanced hardness

Ma, Huan; Zou, Yu; Sologubenko, Alla S.; Spolenak, Ralph

doi:10.1016/j.actamat.2015.07.013

Cited by 36 publications

(7 citation statements)

References 74 publications

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“…This difference in irradiation damage is attributed to the effect of crystal orientation on ion channeling, which allows energetic ions to travel greater distances into the crystalline lattice along open channels with minimal interaction with lattice atoms [47]. In the absence of such channels, energetic ions directly collide with atoms in the diamond lattice, altering sp 3 bonds into sp 2 bonds and implanting points defects, such as vacancies, reducing crystallinity and increasing disorder in the diamond lattice [32,48]. Ion channeling can only occur if crystal is oriented within a critical angle, ψ, of the direction of incident ions from the perfect channeling axis, as proposed by Lindhard et al [49].…”

Section: As Negligible Plasticity Was Observed During Compression The...mentioning

confidence: 99%

Influence of helium ion irradiation on the structure and strength of diamond

Chen

Best

Shorubalko

et al. 2020

Carbon

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Section: As Negligible Plasticity Was Observed During Compression The...mentioning

confidence: 99%

Influence of helium ion irradiation on the structure and strength of diamond

Chen

Best

Shorubalko

et al. 2020

Carbon

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“…A lot of research regarding Ag films prepared by the conventional magnetron sputtering confirms that the films often exhibit a preferred (111) orientation, while those bombarded by the ion beam would transform to (100) or (110) [ 36 , 37 , 38 ]. Some reports illustrate that the mechanical and physical properties of thin films are also affected by their texture [ 34 , 39 ]. As a consequence, in order to avoid the effect of crystal orientation, micro-structure and grain size on adhesive strength, these affecting factors should be as similar as possible.…”

Section: Resultsmentioning

confidence: 99%

Enhancement of the Adhesive Strength between Ag Films and Mo Substrate by Ag Implanted via Ion Beam-Assisted Deposition

Zhu

Meng

et al. 2018

Materials

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Silver-coated molybdenum is an optimum material selection to replace pure silver as solar cell interconnector. However, the low adhesive strength between Ag films and Mo substrate hinders the application of the interconnector, because it is difficult to form metallurgical bonding or compound in the film/substrate interface using conventional deposition. In order to improve the adhesion, some Ag particles were implanted into the surface of Mo substrate by ion beam-assisted deposition (IBAD) before the Ag films were deposited by magnetron sputtering deposition (MD). The objective of this work was to investigate the effect of different assisted ion beam energy on the film/substrate adhesive properties. In addition, the fundamental adhesion mechanism was illustrated. The results revealed that the adhesion between Ag films and Mo substrate could be greatly enhanced by IBAD. With the increase of the assisting ion beam energy, the adhesive strength first increased and then decreased, with the optimum adhesion being able to rise to 25.29 MPa when the energy of the assisting ion beam was 30 keV. It could be inferred that the combination of “intermixing layer” and “implanted layer” formed by the high-energy ion bombardment was the key to enhancing the adhesion between Ag films and Mo substrate effectively.

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“…1×iGBE, and 2×iGBE samples are ion-irradiated, while the reference sample is not. Ar + ion-irradiation is known to introduce void-like damage in metal thin films [60]. However, since the ion-irradiation is only carried out in the microstructure template during iGBE, the damage should be confined within the first 50 nm.…”

Section: Discussionmentioning

confidence: 99%

Engineering the grain boundary network of thin films via ion-irradiation: Towards improved electromigration resistance

Mattina

Shorubalko

et al. 2017

Acta Materialia

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Controlling the grain boundary network of small-scale materials-such as coatings and thin films-is an ambitious goal that would ultimately enable the production of components with tailored properties and improved reliability. In this work we present a new techniquewhich we term ion-induced grain boundary engineering (iGBE)-to engineer the character distribution and connectivity of grain boundaries in gold films in situ, as they are being deposited. iGBE consists of a repeated sequence of ion-induced material removal and material deposition which results in the selection and growth of crystal grains in twinned relationship. This phenomenon yields a substantial increase in the density and connectivity of Σ3 twin boundaries, which have renowned beneficial effect on the material's resistance to intergranular degradation. We confirm the improved reliability of iGBE microstructures by assessing their resistance to electromigration-one of the most common causes of failure in integrated circuit interconnects. We find that, through iGBE, interconnect lifetime increases by three orders of magnitude at standard operating conditions. Since iGBE is materialinsensitive and compatible with standard microfabrication technology, we expect it to have significant impact on microelectronics industry.

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Copper thin films by ion beam assisted deposition: Strong texture, superior thermal stability and enhanced hardness

Cited by 36 publications

References 74 publications

Influence of helium ion irradiation on the structure and strength of diamond

Influence of helium ion irradiation on the structure and strength of diamond

Enhancement of the Adhesive Strength between Ag Films and Mo Substrate by Ag Implanted via Ion Beam-Assisted Deposition

Engineering the grain boundary network of thin films via ion-irradiation: Towards improved electromigration resistance

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