Correction to: Structure, strength, and fracture of electrodeposited nickel and Ni−Co alloys

Thompson, Anthony W.; Saxton, H. J.

doi:10.1007/bf02644131

Cited by 4 publications

(3 citation statements)

References 21 publications

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“…From this result, it is confirmed that grain size increase is due to grain growth only and not due to recrystallization. The previous study also reported that the increase of grain size of microcrystalline electrodeposits upon annealing can be resulted by grain growth only rather than by recrystallization which is explained by small amount of stored strain energy in the materials [32]. Sometimes, though the stored strain energy is small the electrodeposits during heat treatment undergo different stages such as recovery, recrystallization and grain growth [33].…”

Section: Discussionmentioning

confidence: 99%

Thermal stability of pulse electroplated gold films: SEM-EBSD studies

Palli¹,

Dey²

2017

Adv Mater Sci

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This paper reports the effect of annealing at various temperatures on microstructure and microtexture of the gold films deposited onto SiO 2 /Si(100) substrate using pulsed electrodeposition (PED). The samples were annealed for 3 days at 850ºC and for 5 hours at 900ºC and 910ºC. The microstructure and thermal stability of the electrochemically deposited gold films before and after annealing was investigated using scanning electron microscopy (SEM) and electron backscatter diffraction (EBSD) techniques. It is found that with increase of the annealing temperature the grain size of the deposits, the intensity of <0 0 1>//GD fiber texture and the volume fraction, average grain size of cube and rotated cube texture components are also increased whereas the number of grains decreased. Though maximum intensity of the <0 0 1>//GD fiber texture increases upon annealing, the deposition texture of gold film remains unchanged. The transformation of texture component of the annealed gold samples is explained by grain growth only.

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Section: Discussionmentioning

confidence: 99%

Thermal stability of pulse electroplated gold films: SEM-EBSD studies

Palli¹,

Dey²

2017

Adv Mater Sci

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“…Electrodeposited Ni-43 mass% Co was also observed to have a substantially higher fracture toughness of 38 MPa √m[12]. Electrodeposited Ni-43 mass% Co was also observed to have a substantially higher fracture toughness of 38 MPa √m[12].…”

mentioning

confidence: 91%

Micro-Fracture testing of Ni-W Microbeams Produced by Electrodeposition and FIB Machining

et al. 2006

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Electrodeposited nickel-tungsten alloys are being considered as a candidate material for components for microelectromechanical systems (MEMS) fabricated by the LIGA (German acronym for lithography, electrodeposition, and forming) technology. In spite of having a useful range of properties including; hardness and strength, better tribological and chemical resistance and improved high temperature resistance as compared with the conventionally used electrodeposited Ni, these alloys possess certain brittleness. In this study, the fracture toughness of Ni-17.5 at%W alloy microcantilever beams (dimension: 60µm x 20µm x 14µm) fabricated by UV lithography and electrodeposition and notched by focused ion beam machining is investigated. Load was applied to the beams using a nanoindenter, which also allowed accurate positioning of the sample. Fracture toughness was calculated from the fracture load assuming a linear elastic behaviour. The Ni-W alloy beams were found to possess a mean fracture toughness of 2.97 MPa √m. The fracture toughness of Ni-W alloy is found to be higher than that of Sianother important MEMS material, but considerably lower than that of electrodeposited nickel and nickel base alloys.

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“…[1][2][3] However, processing parameters such as Co salt density and current density in the plating solution have important effects on the morphology and abrasion properties of Ni-Co coatings. [4] In fact, the yield and tensile strength can be increased by increasing Co content, but the fracture resistance and ductility will be reduced, [5] thereby limiting its practical application. It was found that the activity of crystal defects can improve the mechanical properties, such as point defects, line defects, and surface defects.…”

Section: Introductionmentioning

confidence: 99%

Study on the dislocation mechanism of Ni₄₇Co₅₃ alloy during rapid solidification

Liu¹,

Liang²,

Chen³

et al. 2022

Chinese Phys. B

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Dislocations and other atomic-level defects play a crucial role in the macroscopic properties of crystalline materials, but it is extremely difficult to observe the evolution of dislocations, due to the limitations of the most advanced experimental techniques. Therefore, in this paper, the rapid solidification process of Ni47Co53 alloy at five cooling rates is studied by molecular dynamics simulation, and the evolutions of microstructure and dislocations are investigated. The results show that FCC are formed at the low cooling rate, and the crystalline and amorphous mixture appear at the critical cooling rate, and the amorphous are generated at the high cooling rate. The crystallization temperature and crystallinity decrease with the increasing of cooling rate. Dislocations are few at the cooling rates of 1*1011, 5*1012 and 1*1013 K/s, and they are most abundant at the cooling rates of 5*1011 and 1*1012 K/s, which both of their lengths are almost identical. A large number of dislocation reactions exist in both cooling rates, in which the interconversion of perfect and partial dislocations is primary. The dislocation reactions are more intense at the cooling rate of 5*1011 K/s, and the slip of some dislocations leads to the interconversion between FCC and HCP, which causes the disappearance of TBs. FCC and HCP are in the same atomic layer and dislocations are formed at the junction due to the existence of TBs at the cooling rate of 1*1012 K/s. The investigation is important for understanding the dislocation mechanism and its influence on crystal structure at atomic scales.

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Correction to: Structure, strength, and fracture of electrodeposited nickel and Ni−Co alloys

Cited by 4 publications

References 21 publications

Thermal stability of pulse electroplated gold films: SEM-EBSD studies

Thermal stability of pulse electroplated gold films: SEM-EBSD studies

Micro-Fracture testing of Ni-W Microbeams Produced by Electrodeposition and FIB Machining

Study on the dislocation mechanism of Ni₄₇Co₅₃ alloy during rapid solidification

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Correction to: Structure, strength, and fracture of electrodeposited nickel and Ni−Co alloys

Cited by 4 publications

References 21 publications

Thermal stability of pulse electroplated gold films: SEM-EBSD studies

Thermal stability of pulse electroplated gold films: SEM-EBSD studies

Micro-Fracture testing of Ni-W Microbeams Produced by Electrodeposition and FIB Machining

Study on the dislocation mechanism of Ni47Co53 alloy during rapid solidification

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Product

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Study on the dislocation mechanism of Ni₄₇Co₅₃ alloy during rapid solidification