Investigation of annealed, thin(~ 2.6 nm)-Al2O3/AlGaN/GaN metal-insulatorsemiconductor heterostructures on Si(111) via capacitance-voltage and current-voltage studies Annealed, thin(~ 2.6 nm)-Al2O3/AlGaN/GaN metal-insulator-semiconductor (MIS) heterostructures on Si(111) are fabricated and studied via capacitance-voltage (C-V) measurements to quantify densities of fast and slow interface trap states and via current-voltage (I-V) measurements to investigate dominant gate current leakage mechanisms. Dual-sweep C-V measurements reveal small voltage hysteresis (~ 1 mV) around threshold voltage, indicating a low slow interface trap state density of ~ 10 9 cm -2 . Frequency-dependent conductance measurements show fast interface trap state density ranging from 8 × 10 12 to 5 × 10 11 eV -1 cm -2 at energies from 0.275 to 0.408 eV below the GaN conduction band edge. Temperature-dependent I-V characterizations reveal that trap-assistant tunneling (TAT) dominates the reverse-bias carrier transport while the electric field across the Al2O3 ranges from 3.69 to 4.34 MV/cm, and the dominant Al2O3 trap state energy responsible for such carrier transport is identified as 2.13 ± 0.02 eV below the Al2O3 conduction band edge. X-ray photoelectron spectroscopy measurements on Al2O3 before and after annealing suggest an annealing-enabled reaction between Al-O bonds and inherent H atoms. Overall, we report that annealed, thin-Al2O3 dielectric is an effective (Al)GaN surface passivation alternative when minimizing passivation-