Corrosion inhibition mechanisms of triazole derivatives on copper chemical mechanical polishing: Combined experiment and DFT study

Liu, Jianghao; Niu, Xinhuan; Jia, Yingqian; Zhan, Ni; Zou, Yida; Shi, Yunhui; Zhou, Jianwei

doi:10.1016/j.apsusc.2024.159469

Applied Surface Science

2024

DOI: 10.1016/j.apsusc.2024.159469

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Corrosion inhibition mechanisms of triazole derivatives on copper chemical mechanical polishing: Combined experiment and DFT study

Jianghao Liu,

Xinhuan Niu,

Yingqian Jia

et al.

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Cited by 11 publications

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Corrosion inhibition mechanisms of triazole derivatives on copper chemical mechanical polishing: Combined experiment and DFT study

Cited by 11 publications

References 59 publications

Machining performance and material removal mechanism of sapphire with novel polishing slurry

Machining performance and material removal mechanism of sapphire with novel polishing slurry

Effect of novel non-inhibitor slurry on chemical mechanical polishing properties of copper interconnect copper film based on experiments and theoretical calculations

Novel full-scale model verified by atomic surface and developed composite microfiber and slurry polishing system

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