Corrosion protection of ENIG surface finishing using electrochemical methods

Bui, Quang Tri; Nam, Nguyễn Đăng; Choi, Don-Hyun; Lee, J B; Lee, C Y; Kar, Abhijit; Kim, J G; Jung, Seung‐Boo

doi:10.1016/j.materresbull.2009.12.006

Cited by 19 publications

(9 citation statements)

References 18 publications

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“…Kebiasaannya, substrat iaitu pad logam kuprum (Cu) digunakan pada PCB yang merupakan tempat untuk menghubungkan antara komponen elektronik dengan PCB tersebut menerusi antarasambungan pateri. Walaupun logam Cu merupakan substrat yang biasa digunakan bagi sambungan pateri, namun begitu, logam Cu ini mudah teroksida dalam keadaan atmosfera (Bui et al 2010). Maka salutan permukaan diperlukan untuk mengekalkan kekonduksian Cu (Lin et al 2016).…”

Section: Pengenalanunclassified

Pengawalan Pertumbuhan Sebatian antara Logam Sambungan Pateri-Papan Litar Bercetak Menggunakan Salutan Nikel

Bakar

Jalar²,

Abdullah

et al. 2018

JSM

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ABSTRAKBahan aloi pateri dalam kumpulan Sn-Ag-Cu (SAC) merupakan bahan pematerian yang bebas plumbum digunakan secara meluas dalam industri elektronik. Antarasambungan pateri bertindak untuk menghubungkan komponen elektronik pada papan litar bercetak (PCB). PCB memainkan peranan yang penting dalam tindak balas pematerian dan mikrostruktur antarasambungan pateri-substrat seterusnya mempengaruhi kebolehharapan suatu sambungan pateri. Pes pateri Sn0.3Ag0.7Cu (SAC0307) dipaterikan pada tiga jenis PCB iaitu PCB tanpa salutan (PCB/Cu) sebagai sampel kawalan, PCB dengan salutan timah (PCB/Sn) dan PCB dengan salutan nikel (PCB/Ni). Kajian ini bertujuan untuk mengkaji kesan salutan permukaan PCB ke atas pertumbuhan sebatian antara logam (IMC) selepas uji kaji penuaan sesuhu yang berbeza selama 1000 jam. Keputusan menunjukkan purata ketebalan lapisan IMC ~ 5.7 μm serta kadar pertumbuhan lapisan IMC yang paling rendah adalah selari dengan tenaga pengaktifan tertinggi dengan salutan Ni iaitu 41 kJ/mol berbanding PCB/Cu dan PCB/Sn. Ini bermakna salutan Ni pada PCB mampu mengawal pertumbuhan IMC sehingga lebih kurang 40% berbanding salutan Sn dan tanpa salutan.Kata kunci: Antarasambungan pateri; salutan Ni; sebatian antara logam; Sn-Ag-Cu; tenaga pengaktifan ABSTRACT Solder alloy materials in Sn-Ag-Cu (SAC) group is a lead free soldering materials which widely used in the electronics industry. Solder interconnection act to attach electronic components to printed circuit boards (PCBs). PCB plays an important role in soldering reactions and microstructure solder interconnection-substrate which further affects the reliability of a solder joint. Solder paste of Sn0.3Ag0.7Cu (SAC0307) is soldered on three types of PCB ie PCB without coating (PCB/Cu) as controlled sample, PCB with tin coating (PCB/Sn) and PCB with nickel coating (PCB/Ni). The purpose of this study was to investigate the effect of PCB surface coating on the growth of intermetallic compound (IMC) after different aging tests for 1000 h. The results showed that the average IMC layer thickness ~ 5.7 μm together with lowest IMC layer growth rate is in line with highest activation energy, 41 kJ/mol with the usage of Ni coating as compared to PCB/Cu and PCB/Sn. This means that the Ni coating on PCB is able to control IMC growth up to 40% compared to Sn coating and non-coating.

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Section: Pengenalanunclassified

Pengawalan Pertumbuhan Sebatian antara Logam Sambungan Pateri-Papan Litar Bercetak Menggunakan Salutan Nikel

Bakar

Jalar²,

Abdullah

et al. 2018

JSM

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“…Electroless nickel/immersion gold (ENIG) plating has many benefits, especially in printed circuit board manufacturing [10]. Generally, the traditional electroless gold baths [2,11] contain cyanide as the strong complexing agent to obtain an excellent Au layer.…”

Section: Introductionmentioning

confidence: 99%

Acceleration effect of Na2S2O3 on the immersion gold plating on Ni-P surface from a sulfite based electrolyte

Gong

et al. 2016

Surface and Coatings Technology

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“…The needs of multifunctional components in electronic industry encourage researchers to improve several features such as low resistance interconnects, high electrical conductivity [1,2,3,4] and develop new formulation for coating [5] to enhance performance and reduce cost maintenance. However, electronic devices in real application will be exposed directly on corrosion element such as air, moisture and corrosive environment.…”

Section: Introductionmentioning

confidence: 99%

“…However, electronic devices in real application will be exposed directly on corrosion element such as air, moisture and corrosive environment. Therefore, to retain its reliability is one of the biggest challenges [1]. Recently, it has been found that corrosion was visible on the surface of ENIG FPCs.…”

Section: Introductionmentioning

confidence: 99%

Corrosion Study of Electrodeposited Co-Ni-Fe Protective Coating on Electroless Nickel Immersion Gold (ENIG) Flexible Printed Circuit

Hyie

Ahmad

Resali

et al. 2014

Procedia Technology

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Corrosion protection of ENIG surface finishing using electrochemical methods

Cited by 19 publications

References 18 publications

Pengawalan Pertumbuhan Sebatian antara Logam Sambungan Pateri-Papan Litar Bercetak Menggunakan Salutan Nikel

Pengawalan Pertumbuhan Sebatian antara Logam Sambungan Pateri-Papan Litar Bercetak Menggunakan Salutan Nikel

Acceleration effect of Na2S2O3 on the immersion gold plating on Ni-P surface from a sulfite based electrolyte

Corrosion Study of Electrodeposited Co-Ni-Fe Protective Coating on Electroless Nickel Immersion Gold (ENIG) Flexible Printed Circuit

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