Corrosion resistance of ternary Sn-9Zn-xIn solder joint in alkaline solution

Nazeri, Muhammad Firdaus Mohd; Mohamad, Ahmad Azmin

doi:10.1016/j.jallcom.2015.11.184

Cited by 40 publications

(16 citation statements)

References 25 publications

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“…The corrosion products analysis (Figure ) also indicates that only Zn element participated in the formation of corrosion products during the corrosion process. Thus, the corrosion product can be explained on the basis of the following reactions:…”

Section: Discussionmentioning

confidence: 99%

Effect of minor Cu addition on corrosion behavior of Sn‐Zn‐xCu touch‐up solder alloys

Peng

Che

Kong

2017

Materials & Corrosion

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The corrosion behavior of Sn‐50Zn‐xCu (x = 0, 1, 2 wt%) touch‐up solder alloys was investigated by electrochemical techniques (potentiodynamic polarization, electrochemical impedance spectroscopy, and open circuit potential) and surface characterization (scanning electron microscopy, energy dispersive X‐ray spectrometry, and X‐ray diffraction), aiming to explore the effects of the Cu addition on the corrosion resistance. The results reveal that the dendritic‐like Zn‐rich phase of Sn‐50Zn was disadvantageous to form a protective corrosion product layer and offered convenient paths for the Cl− penetration into the substrate. However, the Cu addition to Sn‐50Zn based alloys led to the refinement of microstructure and the transformation of Zn‐rich phase's morphology which could result in the formation of more compact corrosion product layer. Thus, the corrosion resistance of Sn‐Zn‐Cu alloys was improved. The corrosion mechanism is also discussed.

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Section: Discussionmentioning

confidence: 99%

Effect of minor Cu addition on corrosion behavior of Sn‐Zn‐xCu touch‐up solder alloys

Peng

Che

Kong

2017

Materials & Corrosion

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“…This differs sometimes (Lin et al , 1998; Mohanty and Lin, 2006, 2007, 2008) according to the metal system used. The common potential range used was −2.0 to +2.0 V (against Hg/HgO) in an alkaline solution (Liew et al , 2012; Mei Lee et al , 2014; Nazeri and Mohamad, 2014a, 2014b, 2016a, 2016b).…”

Section: Corrosion Of Sn-zn Soldersmentioning

confidence: 99%

Corrosion characterization of Sn-Zn solder: a review

Nazeri

Yahaya

Gürsel

et al. 2019

SSMT

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Purpose The purpose of this paper is to review and examine three of the most common corrosion characterization techniques specifically on Sn-Zn solders. The discussion will highlight the configurations and recent developments on each of the compiled characterization techniques of potentiodynamic polarization, potentiostatic polarization and electrochemical impedance spectroscopy (EIS). Design/methodology/approach The approach will incorporate a literature review of previous works related to the experimental setups and common parameters. Findings The potentiostatic polarization, potentiodynamic polarization and EIS were found to provide crucial and vital information on the corrosion properties of Sn-Zn solders. Accordingly, this solder relies heavily on the amount of Zn available because of the inability to produce the intermetallic compound in between the elements. Further, the excellent mechanical properties and low melting temperature of the Sn-Zn solder is undeniable, however, the limitations regarding corrosion resistance present opportunities in furthering research in this field to identify improvements. This is to ensure that the corrosion performance can be aligned with the outstanding mechanical properties. The review also identified and summarized the advantages, recent trends and important findings in this field. Originality/value The unique challenges and future research directions regarding corrosion measurement in Sn-Zn solders were shown to highlight the rarely discussed risks and problems in the reliability of lead-free soldering. Many prior reviews have been undertaken of the Sn-Zn system, but limited studies have investigated the corrosive properties. Therefore, this review focuses on the corrosive characterizations of the Sn-Zn alloy system.

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“…In the solder joint evaluation, the cross-sectioned area was mainly utilized (Salleh et al, 2012;Affendy et al, 2014;Nazeri and Mohamad, 2016;Gain et al, 2011). This proved to be beneficial in providing information related to (Hu et al, 2015) the following:…”

Section: Measurements On Solder Jointsmentioning

confidence: 99%

Hardness testing of lead-free solders: a review

Yahaya

Mohamad

2017

SSMT

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Purpose This paper aims to cover the recent (2010-2016) techniques for carrying out hardness evaluation on lead-free solders. Details testing configuration/design were compiled and discussed accordingly to each of the measurement techniques: Vickers microhardness, Brinell microhardness and nanoindentation. Design/methodology/approach A brief introduction on lead-free solders and the concept of hardness testing has been described at the beginning of the review. Equipment setup, capabilities, test configuration and outcomes were presented for each technique and discussed in parallel along with the case studies from selected articles. Findings Comparison, outcomes and insight regarding each of the methods were highlighted to observe the recent trends, scientific challenges, limitations and probable breakthroughs of the particular hardness testing methods. Originality/value The compilation of latest reports, technical setup plus with the critics and perception from the authors are the main key value in this review. This provides an in-depth understanding and guidance for conducting hardness evaluation on lead-free solders.

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Corrosion resistance of ternary Sn-9Zn-xIn solder joint in alkaline solution

Cited by 40 publications

References 25 publications

Effect of minor Cu addition on corrosion behavior of Sn‐Zn‐xCu touch‐up solder alloys

Effect of minor Cu addition on corrosion behavior of Sn‐Zn‐xCu touch‐up solder alloys

Corrosion characterization of Sn-Zn solder: a review

Hardness testing of lead-free solders: a review

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