2020 IEEE 29th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) 2020
DOI: 10.1109/epeps48591.2020.9231382
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Cost-Effective Implementation of Air-Filled Waveguides on Printed Circuit Boards

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Cited by 2 publications
(4 citation statements)
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“…In order to identify the mechanisms of coupling, air was assumed as TL dielectric substrate material and annular fluid to allow the determination of EM field distribution within the modeling domain. This assumption is consistent with practical air-filled transmission lines [49], [50], [51].…”
Section: B Solution Methodologysupporting
confidence: 86%
“…In order to identify the mechanisms of coupling, air was assumed as TL dielectric substrate material and annular fluid to allow the determination of EM field distribution within the modeling domain. This assumption is consistent with practical air-filled transmission lines [49], [50], [51].…”
Section: B Solution Methodologysupporting
confidence: 86%
“…The replication of large recesses as analyzed in Section 3.2 shows that recesses with high wall thickness variations can be manufactured by injection-compression molding even with high-temperature thermoplastics. Large recesses in 2.5D substrates could be used to form SMD-mountable air-filled waveguide devices on PCBs, as described in [10,40]. The manufactured recesses with a depth of about 500 µm could be used to form air-filled waveguides up to a size of WR-4 (height = 0.5461 mm) [41].…”
Section: Discussionmentioning
confidence: 99%
“…Concepts for micromachined transmission line structures were, as mentioned above, reported by several publications [4][5][6][7][8][9][10][11][12][13]. The main benefit of trenches in the isolation gaps between signal and ground traces in CPW transmission lines is the reduction of the effective permittivity DK e f f that is experienced by transmission lines, as only a part of their electromagnetic field is concentrated in the dielectric.…”
Section: Discussionmentioning
confidence: 99%
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