Proceedings of the 2014 on International Symposium on Physical Design 2014
DOI: 10.1145/2560519.2560532
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Coupling-aware force driven placement of TSVs and shields in 3D-IC layouts

Abstract: In 3D ICs, TSV cross coupling can seriously degrade circuit performance if it is not sufficiently considered in a design. Cross coupling is heavily dependent on how TSVs are placed, and should be considered during the floorplanning of the chip. In this work we propose a coupling-aware TSV placement algorithm that attempts to reduce both wirelength and TSV cross coupling. TSV shielding is another method for coupling mitigation, and the proposed algorithm combines coupling-aware TSV placement with shield inserti… Show more

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Cited by 1 publication
(4 citation statements)
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References 11 publications
(29 reference statements)
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“…As we observed in our original analysis of the results of the "Fixed Cells" algorithm [12], spreading TSVs can greatly increase the effectiveness of SI by providing more potential positions for shields. During the TSV spreading stage of the algorithm all standard cell positions are fixed and only the TSVs are movable.…”
Section: A Tsv Spreading Stagementioning
confidence: 78%
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“…As we observed in our original analysis of the results of the "Fixed Cells" algorithm [12], spreading TSVs can greatly increase the effectiveness of SI by providing more potential positions for shields. During the TSV spreading stage of the algorithm all standard cell positions are fixed and only the TSVs are movable.…”
Section: A Tsv Spreading Stagementioning
confidence: 78%
“…For our first experiment, we ran all algorithm variations on the randomized benchmarks developed in [12]. For each algorithm and each benchmark, we report the maximum Table II that in all three algorithm variants, the newly proposed "Movable Cells" algorithm is able to reduce the worst case coupling more than the "Fixed Cells" algorithm.…”
Section: Randomized Benchmark Resultsmentioning
confidence: 99%
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