Coupling damage and reliability modeling for creep and fatigue of solder joint

Correlation-driven machine learning for accelerated reliability assessment of solder joints in electronics

“…Contrary to the fatigue mechanism, creep depreciation is time-dependent and the dwelling time period is tremendously impressive 63 . Of particular note is that the pure creep strain is racked up during the hot dwelling phase, whereas the induced strain during the temperature ramps is mainly uncomprehensive owing to the severe differences in component coefficient of thermal expansion (CTE), which is correlated with the fatigue mechanism 64 . The creep lifetime has been commonly modeled using the Monkman–Grant Equation 65 : where C MG and β are constant and material-dependent.…”

Effects of Creep Failure Mechanisms on Thermomechanical Reliability of Solder Joints in Power Semiconductors

“…Zhang et al [11] used finite element simulation and showed that the maximum stress concentrated location established a relationship with heights of solder joints. Chen et al [12] proposed a model to evaluate the coupling damage effects of low cycle fatigue and creep events under thermal cycling of an electronic device. Their case study on a lead free solder joint validated the damage model.…”

Study on Chip Reliability Modeling Based on Mutually Dependent Competing Failure of Solder Joints in Different Failure Modes

“…In [18], Darveaux model was used to predict solder joint remaining life. Chen et al [19] modified a failure physical model considering coupling environment stress. Osarumen et al [20]employed the Garofalo creep model by FEM simulate to discuss the creep effect of material solder joint.…”