1984
DOI: 10.1109/t-ed.1984.21526
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Coupling effects in the time domain for an interconnecting bus in high-speed GaAs logic circuits

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Cited by 54 publications
(10 citation statements)
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“…To suppress crosstalk even further, some studies have proposed using a guard trace, which is one extra trace without any signal between two coupling signal traces [11,[14][15][16][17]. As the guard trace acts as a transmission line, it cannot remain at ground potential throughout its entire length [23].…”
Section: Guard Tracementioning
confidence: 99%
See 1 more Smart Citation
“…To suppress crosstalk even further, some studies have proposed using a guard trace, which is one extra trace without any signal between two coupling signal traces [11,[14][15][16][17]. As the guard trace acts as a transmission line, it cannot remain at ground potential throughout its entire length [23].…”
Section: Guard Tracementioning
confidence: 99%
“…However, because the remaining 30% flux boundary can still negatively affect the signal quality in high-speed, high-density, space-limited, low-voltage PCB designs, the addition of a guard trace that carries no signal has been proposed to reduce the noise induced in a victim by the aggressor and avoid crosstalk [11,[14][15][16][17]. A guard trace that is left unterminated (i.e., open termination) will experience noise and act as a potential source of noise for the victim [11,17].…”
Section: Introductionmentioning
confidence: 99%
“…Another technique to reduce the crosstalk noise is the placement of guard trace, i.e., to shield the coupling between adjacent signal lines by inserting a grounded trace [7], [8]. Intuitively, it blocks a significant part of the mutual coupling, thus being capable of suppressing both the NEXT and FEXT.…”
Section: Introductionmentioning
confidence: 99%
“…Although considerable amount of work has been done in recent years on the computation on the propagation characteristics of multiple coupled strip lines, a small number [1][2][3][4][5][6][7][8][9][10][11][12] of researchers have dealt with some aspects of the problem of calculation of the self and mutual line constants of on-chip interconnections, and a very limited number [3][4][5][6][7][8][9][10][11][12][13][14][15][16] has tackled the problem of 3-D multilevel metallization structures. 199 The purpose of this work is the detailed presentation of a self contained method developed 17 for the electrical modelling of lossy-coupled multilayer on-chip interconnection lines at high bit rates, which can be used by the VLSI designer in conjunction with existing electrical simulation packages.…”
Section: Introductionmentioning
confidence: 99%