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An investigation of the electrical performances of an assembled SO8 package is presented. Using an equivalent electric network elaborated for the whole assembly, the isolation and the insertion losses are computed for a signal frequency up to 5 GHz. From our modelling and simulation results, the significant effect of the path connection to ground is shown, and the required modifications of the connecting layout are discussed. Our modelling concept, demonstrated on the SO8 package, is applicable on any single chip package. 93CH3316-7/93/0000-0109$01 .OO 0 1993 IEEE IEEE 1993 Microwave and Millimeter-Wave Monolithic Circuits Symposium