1995 IEEE Ultrasonics Symposium. Proceedings. An International Symposium
DOI: 10.1109/ultsym.1995.495577
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Coupling-of-modes modelling for fast and precise simulation of leaky surface acoustic wave devices

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Cited by 26 publications
(10 citation statements)
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“…We first describe the coupling-of-modes (COM) model approach used for analysis of one-port SAW resonator. Compared with other models for the design and analysis of SAW devices, the COM model provides an efficient and highly flexible approach for modeling various types of electrodes, and it has been used widely in modeling nondispersive SAW devices for many years [5]- [7]. Parameters of the COM differential equations usually are obtained by measurements or by borrowing from same related theoretical modeling [8], [9].…”
Section: Introductionmentioning
confidence: 99%
“…We first describe the coupling-of-modes (COM) model approach used for analysis of one-port SAW resonator. Compared with other models for the design and analysis of SAW devices, the COM model provides an efficient and highly flexible approach for modeling various types of electrodes, and it has been used widely in modeling nondispersive SAW devices for many years [5]- [7]. Parameters of the COM differential equations usually are obtained by measurements or by borrowing from same related theoretical modeling [8], [9].…”
Section: Introductionmentioning
confidence: 99%
“…Compared with other models for the design and analysis of SAW devices, the coupling of modes (COM) model provides an efficient and highly flexible approach for modeling various types of electrodes, and has been used widely in modeling no dispersive SAW devices for many years [5]. Parameters of the COM differential equations are usually obtained by measurements or by borrowing from same related theoretical modeling [6].…”
Section: Introductionmentioning
confidence: 99%
“…II, has been simulated on the neutral test and on the quasiapplication PCB structure using techniques explained in [3][4][5]. In Fig.…”
Section: Resultsmentioning
confidence: 99%
“…A combination of commercial field simulators for PCB and package simulation and proprietary tools for SAW chip simulation has proven best for this purpose [3][4][5]. Fig.…”
Section: Characterization Of Relevant Effects By Measurement and mentioning
confidence: 99%