Coupling structure in LED system-in-package design: A physical responses-based critical parameter sheet like approach

Borst, E.C.M. de; Gielen, A.W.J.; Etman, L.F.P.

doi:10.1109/estc.2012.6542063

Cited by 1 publication

(1 citation statement)

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“…The integrated and miniaturized package reduces manufacturing and material costs. Due to integration in the system, the coupling in the product design becomes more prominent (de Borst et al 2012). Unlike traditional devices built on printed-circuitboards, the interaction between the different functional components goes beyond the electrical domain: heat generation, electromagnetic fields, optical interference, and mechanical loads between the functional components must be taken into account to obtain a LED SiP with a good performance and lifetime.…”

Section: Led System-in-packagementioning

confidence: 99%

Decomposition analysis of the multidisciplinary coupling in LED System-in-Package design using a DSM and a specification language

Borst

Etman

Gielen³

et al. 2016

Struct Multidisc Optim

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LED System-in-Package (SiP) aims to reduce manufacturing and material costs of LED lighting products through integration of components into one single package, based on semiconductor technology. This introduces multidisciplinary coupling in the system behavior which requires reconsideration of the existing LED design decomposition practice. This paper presents our method to do a decomposition analysis of the multidisciplinary coupling structure for an industry scale LED SiP design problem. The innovative aspect of our method is the use of a specification language to specify the input-output (binary) relationships between design variables, behavioral responses, objective and constraint responses. A design structure matrix, representing the mutual linkage, is automatically generated from the specification. The rows and columns of the DSM are subsequently re-ordered using partitioning and sequencing algorithms to provide insight in the coupling structure. The method is illustrated by means of a simplified example. This paper is a revised and extended version of proceedings paper "Decomposition-based analysis of the multi-physical coupling structure in LED System-in-Package design" presented by the authors at the 10th World Congress on Structural and Multidisciplinary Optimization, May 19-24, 2013 Subsequently, the results for a recently manufactured LED SiP design prototype are presented.

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Section: Led System-in-packagementioning

confidence: 99%