Covalently bonded silica interfacial layer for simultaneously improving thermal and dielectric performance of copper/epoxy composite

Zheng, Kun; Wang, Dan; Duo, Leijiao; Sun, Fangyuan; Zhang, Zongbo; He, Yifan; Li, Pengfei; Ma, Yuantai; Xu, Caihong

doi:10.1016/j.surfin.2021.101404

Cited by 5 publications

(3 citation statements)

References 45 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Pure PU polymer usually possesses extremely low thermal conductivity. So various series of thermally conductive fillers including ceramic, 5,[12][13][14][15] metallic, [16][17][18] and carbon-based conductive fillers [19][20][21][22][23] are introduced to polymer matrix in order to improve the thermal conductivity of materials. However, the modulus mismatch between fillers and polymer matrix leads to the internal stress concentration, the increase of rigidity, and the decrease of flexibility and ductility of composites.…”

Section: Introductionmentioning

confidence: 99%

Castor oil‐based polyurethane ternary composites with enhanced thermal conductivity and mechanical properties by using liquid metal as second filler

Xu,

Du,

Jia

et al. 2024

Polymer Composites

View full text Add to dashboard Cite

With the miniaturization, high frequency of electronic devices, and low‐carbon and sustainable development, higher requirements are put forward for thermal conductive polyurethane composites in terms of comprehensive performance and renewable raw materials. Herein, choosing bio‐based polyurethane (PU) derived from castor oil as matrix, and liquid metal (LM) and aluminum hydroxide (ATH) as hybrid thermal conductive filler, castor oil‐based PU composites were developed via high‐speed rotation and in‐situ polymerization method. The LM‐ATH hybrid filler displayed a synergistic enhancement effect on the thermal conductivity of composites due to the presence of LM‐bridging significantly improved the effective contact probability between ATH fillers. The thermal conductivity of 50LM‐ATH/PU reached 1.69 Wm−1 K−1, which was 9.9 times and 1.4 times higher than that of pure PU and 50ATH/PU, respectively. Notably, the 50LM‐ATH/PU exhibited outstanding mechanical properties including tensile strength up to 4.0 MPa and adhesion strength up to 7.9 MPa, especially elongation at break up to 120% which was improved by 200% compared with 50ATH/PU (40%). Additionally, the composite possessed excellent electric insulation, thermal stability, and inflaming retarding properties, showing great application potential in the electronic devices field.Highlights Castor oil‐based PU composites with ATH‐LM hybrid filer were developed. LM‐ATH hybrid filler of 2:8 promoted the thermal conductivity of composites. Hybrid filler than ATH‐endowed composites with better mechanical properties. The ATH‐LM/PU exhibited excellent electric insulation.

show abstract

Section: Introductionmentioning

confidence: 99%

Castor oil‐based polyurethane ternary composites with enhanced thermal conductivity and mechanical properties by using liquid metal as second filler

Xu,

Du,

Jia

et al. 2024

Polymer Composites

View full text Add to dashboard Cite

show abstract

“…The epoxy resins, which have great mechanical and electrical insulating qualities and can offer strong adhesion between metals, become a good alternative [9]. Usually, fillers with high inherent thermal conductivity were added to the epoxy resins for creating advanced TIMs [10][11][12][13][14][15][16].…”

Section: Introductionmentioning

confidence: 99%

Enhanced thermal properties of epoxy composites by constructing thermal conduction networks with low content of three-dimensional graphene

Huang

Zhang

et al. 2023

Nanotechnology

View full text Add to dashboard Cite

Micro/nano electronic devices heat dissipation depends heavily on the thermal interface materials (TIMs). Despite notable progress, it is hard to efficaciously enhance the thermal properties of the hybrid TIMs with high-load additives due to an absence of effective heat transfer routes. Herein, the low content of 3D graphene with interconnected networks is adopted as the additive to improve the thermal properties of epoxy composite TIMs. The thermal diffusivity and thermal conductivity of the as-prepared hybrids were dramatically improved by constructing thermal conduction networks after adding 3D graphene as fillers. The 3D graphene/epoxy hybrid's optimal thermal characteristics were observed at 1.5 wt% of 3D graphene content, corresponding to a maximum enhancement of 683%. Besides, heat transfer experiments were further performed to determine the superb heat dissipation potential of the 3D graphene/epoxy hybrids. Moreover, the 3D graphene/epoxy composite TIM was also applied to high-power LED to improve heat dissipation. It effectively reduced the maximum temperature from 79.8 °C to 74.3 °C. These results are beneficial for the better cooling performance of electronic devices and provide useful guidelines for advancing the next-generation TIMs.

show abstract

“…[3] TIMs, including pad, tape, film, gel, grease, and paste, are composed of hard fillers with a high thermal conductivity κ (as listed in Table 1) and a flexible polymer matrix, which always has a low κ (0.2-0.5 W m À1 K À1 ). [1,4] Metal and C-related particles with high κ, such as Al, [5] Cu, [6] and graphite, [7,8] are commonly used effectively at a high filler volume fraction f of approximately 50 vol%. Since a large aspect ratio r for such fillers enables the formation of thermal pathways at low f, the use of one-or twodimensional materials, such as SiC whiskers (SiC w ), [9,10] carbon fibers (C f ), [11,12] especially multi-walled carbon nanotubes (MWCNTs) [13] and graphene, [14] has led to impressive results.…”

Section: Introductionmentioning

confidence: 99%

Thermal and dielectric multiple percolation in α‐Si₃N₄ whiskers/silicone rubber

Zhang

Liu

Yang

et al. 2023

Polymer Engineering & Sci

View full text Add to dashboard Cite

Currently, thermal interfacial materials (TIMs) play a great role to electronic and semiconductor devices working at high voltage, power and frequency. The urgent need for electrical insulating TIMs and relevant theory are not addressed yet. This study adopted an electrical insulating α‐Si3N4 whisker as a filler to prepare Si3N4w/silicone rubber. The results show that the elongation at break and thermal conductivity of silicone rubber are promoted from 91.6% and 0.343 to 402.9% and 1.011 W m−1 K−1, respectively, at a filler fraction of 8.0 vol%. It reveals a multiple percolation phenomenon which has not been previously observed in an electrical insulating TIMs. The thermal percolation threshold is decreased to 4.0 vol% with increasing aspect ratio of the whisker. The behavior of the dielectric strength is explained by a double percolation model. A phonon quasi‐ballistic transportation mechanism based on Coulomb interactions is proposed for the TIMs.

show abstract

Covalently bonded silica interfacial layer for simultaneously improving thermal and dielectric performance of copper/epoxy composite

Cited by 5 publications

References 45 publications

Castor oil‐based polyurethane ternary composites with enhanced thermal conductivity and mechanical properties by using liquid metal as second filler

Castor oil‐based polyurethane ternary composites with enhanced thermal conductivity and mechanical properties by using liquid metal as second filler

Enhanced thermal properties of epoxy composites by constructing thermal conduction networks with low content of three-dimensional graphene

Thermal and dielectric multiple percolation in α‐Si₃N₄ whiskers/silicone rubber

Contact Info

Product

Resources

About

Covalently bonded silica interfacial layer for simultaneously improving thermal and dielectric performance of copper/epoxy composite

Cited by 5 publications

References 45 publications

Castor oil‐based polyurethane ternary composites with enhanced thermal conductivity and mechanical properties by using liquid metal as second filler

Castor oil‐based polyurethane ternary composites with enhanced thermal conductivity and mechanical properties by using liquid metal as second filler

Enhanced thermal properties of epoxy composites by constructing thermal conduction networks with low content of three-dimensional graphene

Thermal and dielectric multiple percolation in α‐Si3N4 whiskers/silicone rubber

Contact Info

Product

Resources

About

Thermal and dielectric multiple percolation in α‐Si₃N₄ whiskers/silicone rubber