2019
DOI: 10.1088/1361-6439/ab2f25
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Cracks in the 3D-printed conductive traces of silver nanoparticle ink

Abstract: Printing conductive traces of sinterable metallic nanoparticle (NP) based inks is one of the key components of 3D additively manufactured (printed) electronic circuits. In this study, we employ 3D aerosol jet printing to print conductive traces of silver NP based ink and provide insights into the risk of cohesive longitudinal cracking inside the printed and sintered traces. This was investigated for a wide range of carrier and sheath gas flow rates, which implies a wide range of particle deposition rates and v… Show more

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Cited by 15 publications
(12 citation statements)
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“…To measure adhesion, the standard ASTM Crosshatch Testing Tape kit was used (ASTM-3359-95a). 15 For the samples printed on the Kapton substrate, the crosshatch tool was unable to develop the necessary pattern for testing without piercing through the Kapton substrate. Hence, samples printed on Kapton were only tested by applying scotch tape and inspecting for dielectric material removal after peeling the tape off the surface.…”
Section: Secondary Heat Treatment Investigationsmentioning
confidence: 99%
See 1 more Smart Citation
“…To measure adhesion, the standard ASTM Crosshatch Testing Tape kit was used (ASTM-3359-95a). 15 For the samples printed on the Kapton substrate, the crosshatch tool was unable to develop the necessary pattern for testing without piercing through the Kapton substrate. Hence, samples printed on Kapton were only tested by applying scotch tape and inspecting for dielectric material removal after peeling the tape off the surface.…”
Section: Secondary Heat Treatment Investigationsmentioning
confidence: 99%
“…During the curing of the solvent-based material, the film will shrink, causing stress and expelling toxic nonpolar volatile organic compounds. 15 Recently, the lack of printable dielectrics, which exhibit low dielectric loss and minimal thermal expansion and adhesion onto conventional substrates, has been the focus of both commercial and academic research. Fedynyshyn et al developed a syringe dispensable triblock copolymer material, which exhibited a dielectric loss of 0.005 at the Ku band (26.5−40.0 GHz).…”
Section: Introductionmentioning
confidence: 99%
“…The build plate was heated to 50 • C to ensure solvents within the ink evaporated properly. Studies related to reliability, physics-of-failure, and adhesion with FR4 substrate have shown that high quality conductive traces can be obtained by controlling ink concentration and curing temperature [34][35][36]. The thermal procedure includes heating up in an oven from room temperature to 150 • C with a ramp rate of 2 • C/min, setting for 3 h, and subsequently cooling down in air.…”
Section: Ajp Trace Printingmentioning
confidence: 99%
“…The printing and fabrication parameters are listed in Table 2. While these specific prototype parts have not undergone reliability testing, the materials used to fabricate these parts have undergone materials physics-of-failure testing [35,36] and other related additively fabricated circuits have been through [39] and are currently undergoing comprehensive reliability testing.…”
Section: Ajp Trace Printingmentioning
confidence: 99%
“…Despite the body of work, the NP-based layer suffers from thermally induced microcracks and pores, causing device failure. , The attempts to resolve this issue focused on pressure- or ultrasonic-assisted sintering. , However, there is still a strong demand for new conductive inks, which will enable the deposition of stable and durable layers.…”
Section: Introductionmentioning
confidence: 99%