Creep and ductility in an Al-Cu solid-solution alloy

Chaudhury, Prabir K.; Mohamed, Farghalli A.

doi:10.1007/bf02647082

Cited by 68 publications

(42 citation statements)

References 41 publications

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“…5. The transition from VGC to DCC as shown in various solid solution alloys 9,10,[30][31][32][33][34] The expanded normalized stress-strain rate plot containing data for pure magnesium 10) and Mg-0.8%Al alloy.…”

Section: Transition Of Deformation Mechanism In Mg Alloysmentioning

confidence: 99%

Creep Deformation Mechanisms in Coarse-Grained Solid Solution Mg Alloys

et al. 2004

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Creep deformation behavior of coarse-grained Mg-Al based solid solution alloy (AZ31) was studied in a wide strain rate range of 2 Â 10 À5 $7 Â 10 À2 s À1 at temperature range of 573$673 K. Viscous glide controlled creep (VGC), dislocation climb creep (DCC) and power law breakdown (PLB) showed up in order with increasing stress as the flow rate-controlling process. From the former results for Mg-Al and MgAl-Zn alloys, the creep mechanisms of VGC and DCC in Mg and Mg alloys are confirmed. Moreover, several theories presented for DCC and VGC are applied to convey the creep mechanisms in Mg and Mg alloys by analytical way. Transitions in Mg alloys are analyzed also by comparing experimental results and theories. Alloying effects on creep strength and transitions of deformation mechanism are analyzed.

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Section: Transition Of Deformation Mechanism In Mg Alloysmentioning

confidence: 99%

Creep Deformation Mechanisms in Coarse-Grained Solid Solution Mg Alloys

et al. 2004

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“…Many researchers have suggested that the flow stress during climb-controlled dislocation creep in solid solution alloys such as Al-based alloys, [28][29][30] Cu-based alloys 31) and Mg-based alloys 32,33) is dependent on the stacking fault energy. The decrease in stacking fault energy due to the alloying in solid solution alloys usually improves the creep resistance.…”

Section: Discussionmentioning

confidence: 99%

“…The decrease in stacking fault energy due to the alloying in solid solution alloys usually improves the creep resistance. [28][29][30][31][32][33] It is explained that the root of solid solution strengthening in Sn-Zn alloys is also the decrease in the stacking fault energy due to the addition of Zn.…”

Section: Discussionmentioning

confidence: 99%

Effect of Small Addition of Zinc on Creep Behavior of Tin

Hamada

Uesugi

et al. 2010

Mater. Trans.

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Sn-based alloys with high creep resistance are required for soldering applications. This paper describes the effect of solid solution strengthening on the creep resistance of Sn-Zn alloys. The maximum solubility limit of Zn is 0.34 mass% in Sn. The creep behaviors of Sn, Sn-0.1 mass%Zn and Sn-0.4 mass%Zn were examined at 298 and 398 K under constant strain rates ranging from 1 Â 10 À4 to 1 Â 10 À2 s À1 . The creep resistance of Sn was improved significantly by the addition of a small amount of Zn owing to the solid solution strengthening. The creep resistance of Sn-0.4 mass%Zn was at the same level as that of Sn-37 mass%Pb. We obtained a stress exponent of about 7 and an activation energy of 41-45 kJ/mol, which indicates that the creep behavior was climb-controlled dislocation creep controlled by pipe diffusion. The finding that a small addition of Zn improves the creep resistance is useful for developing new Pb-free solders.

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“…For pure metals, such as aluminum, and solid-solution alloys of class II (metal class), such as aluminum-5% zinc [232), n -5 whereas for solid-solution alloys of class I (alloy class), such as aluminum-copper alloys [233] and aluminum-magnesium alloys [234,235], n can be 3 or 5 depending on experimental conditions and materials parameters [236,237]. The creep behavior of metals and alloys of class II is generally attributed to some form of dislocation climb process [230,231,[236][237][238] whereas that of alloys of class I is generally attributed to the presence of a viscous drag process operating on the dislocations during glide [230,231,236,237,239].…”

Section: Deformation Models Based On Dislocation Motionmentioning

confidence: 99%

“…However, it is worth mentioning that creep activation energies measured in some Al solid-solution alloystt [233,252,253] at high stresses, where n=5, are higher than that for self diffusion and range from 160-210 U/mole: for example, Qc reported for Al-3% Cu [233] under the above conditions (-r > 5 MPa and n=5) is 205 U/mole. 12 524 234 14 438 249 16 397 255 18 340 225 20 338 241 22 322 237 24 308 232 26 291 222 28 275 212 30 263 201 32 246 191 Avg.…”

mentioning

confidence: 93%

Mechanical Behavior and Processing of Aluminum Metal Matrix Composites

Lavernia¹,

Mohamed²

1992

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Creep and ductility in an Al-Cu solid-solution alloy

Cited by 68 publications

References 41 publications

Creep Deformation Mechanisms in Coarse-Grained Solid Solution Mg Alloys

Creep Deformation Mechanisms in Coarse-Grained Solid Solution Mg Alloys

Effect of Small Addition of Zinc on Creep Behavior of Tin

Mechanical Behavior and Processing of Aluminum Metal Matrix Composites

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