Creep crack initiation at a free edge of an interface between submicron thick elements

Hirakata, Hideki; Hirako, Toshihiro; Takahashi, Yoshihiro; Matsuoka, Yasunori; Kitamura, Takayuki

doi:10.1016/j.engfracmech.2008.01.007

Cited by 19 publications

(4 citation statements)

References 24 publications

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“…The experimental data obtained by Hirakata (Hirakata et al, 2008) was adopted in this study. Figure 4 shows the specimen and the loading system in the creep test.…”

Section: Experimental Datamentioning

confidence: 99%

“…The ion beam direction was set to be almost perpendicular to the (111) surface of the Si substrate to avoid serious damage to the interface edge from the beam bombardment. In the original paper (Hirakata et al, 2008), four specimens were tested under creep. However, the last two specimens were not used in this study because the time was short and did not have clear creep.…”

Section: Experimental Datamentioning

confidence: 99%

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Cohesive Zone Model Applied to Creep Crack Initiation at an Interface Edge between Submicron Thick Films

Truong

Kitamura

2009

International Journal of Damage Mechanics

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A crack initiates at an interface edge between submicron thick films and leads to the malfunction of microelectronic devices. In this study, the cohesive zone model method with a cohesive law based on the damage mechanics concept is developed to simulate the creep crack initiation at an interface edge between tin and silicon films. Experiments on delamination at the Sn/Si interface using a micro-cantilever bend specimen were conducted. The cohesive law is applied to the elements in the UEL user subroutine in the finite element code ABAQUS. The parameters characterizing the cohesive law are calibrated by fitting displacement-time curves obtained by experiments and FEM simulations. It is revealed that the order of stress singularity increases with time and has a significant jump in its value at the crack initiation.

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“…The experimental data obtained by Hirakata (Hirakata et al, 2008) was adopted in this study. Figure 4 shows the specimen and the loading system in the creep test.…”

Section: Experimental Datamentioning

confidence: 99%

Section: Experimental Datamentioning

confidence: 99%

Cohesive Zone Model Applied to Creep Crack Initiation at an Interface Edge between Submicron Thick Films

Truong

Kitamura

2009

International Journal of Damage Mechanics

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“…Recently, focused ion beam (FIB) processing has enabled fabrication of nanoscale specimens for precise mechanical testing [16,17]. In addition, a recently developed advanced loading system composed of a piezoelectric actuator and MEMS (Micro electro mechanical systems) load and displacement sensors makes it possible to directly apply a sensitive load to the nanoscale specimen and then measure it [18][19][20][21].…”

Section: Introductionmentioning

confidence: 99%

Cu/Si interface fracture due to fatigue of copper film in nanometer scale

Sumigawa

Murakami

Shishido

et al. 2010

Materials Science and Engineering: A

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In order to investigate the fatigue behavior of metals in nanoscale, a cyclic bending experiment is carried out using a nano-specimen. The specimen includes a copper film with a thickness of 20 nm constrained by highly rigid materials, which yields a high strain region with a size of a few nanometers near the interface edge. The specimen broke before the maximum load in the 7th cycle under fatigue (load range of 18 μN). The load-displacement curve shows nonlinear behavior and a distinct hysteresis loop, indicating plasticity in the Cu film. Reverse yielding appearing after the 2nd cycle suggests the development of a cyclic substructure in the Cu film. The cumulative plastic strain in the Cu film at fracture is more than three times larger than that under monotonic loading. These results indicate that the specimen breaks owing to fatigue of the Cu film on the nanoscale.

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“…Matoy et al [29], Hirakata et al [30], and Chan et al [31], used notched MC configurations to initiate delamination of SiO/W and SiO/Cu, Sn/Si, and Zr/hydride interfaces, respectively. Delamination generally occurred in an unstable manner due to the interfaces being orientated perpendicular to the axis of the MCs; prompting the development of alternative configurations [32].…”

Section: Introductionmentioning

confidence: 99%

Inducing stable interfacial delamination in a multilayer system by four-point bending of microbridges

Mead

Huang

2017

Surface and Coatings Technology

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The ability to produce stable delamination of thin film multilayer interfaces is a powerful tool for studying the interfacial adhesion within microsystems. In this study, a technique involving the four-point bending of microbridges was applied to initiate stable interfacial delamination within a multilayer system. Microscale pre-notched bridges with clamped-ends were machined into an Al/SiN/GaAs multilayer using focus ion beam milling. A square flat-end indenter was used to induce bending of the bridge by two contact locations. Bridge failure occurred via substrate fracture at the pre-notch, followed by crack deflection, and stable interfacial delamination of the SiN/GaAs interface. Substrate fracture and delamination were identified within the obtained load-displacement curves as a pop-in and region of linear load reduction respectively.

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Creep crack initiation at a free edge of an interface between submicron thick elements

Cited by 19 publications

References 24 publications

Cohesive Zone Model Applied to Creep Crack Initiation at an Interface Edge between Submicron Thick Films

Cohesive Zone Model Applied to Creep Crack Initiation at an Interface Edge between Submicron Thick Films

Cu/Si interface fracture due to fatigue of copper film in nanometer scale

Inducing stable interfacial delamination in a multilayer system by four-point bending of microbridges

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