“…Various micro-mechanical testing techniques have been developed to characterize interfacial adhesion. Nanoindentation [ 8 , 9 , 10 , 11 , 12 ], nanoscratch [ 13 , 14 ], and micro-cantilever (MC) and micro-bridge (MB) bending [ 7 , 15 , 16 , 17 , 18 ] are widely used. From these, nanoscratch is considered to be a semi-quantitative approach [ 19 ], whereas top-surface nanoindentation has been used to measure the interfacial strength and toughness of a stiff dielectric film attached onto a comparatively ductile semiconductor substrate [ 19 , 20 ].…”