Creep–Fatigue Crack Growth Behavior of Pb-Containing and Pb-Free Solders at Room and Elevated Temperatures

Fakpan, Kittichai; Otsuka, Yuichi; Mutoh, Yoshiharu; Inoue, Shunsuke; Nagata, Kohsoku; Kodani, Kazuya

doi:10.1007/s11664-012-2061-2

Cited by 15 publications

(6 citation statements)

References 12 publications

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“…Crack growth fatigue tests of SAC305 solder alloy have been carried out, and the results indicated that the crack growth behaviour of that alloy was dependent on not only frequency but also temperature factors. 21 In order to find the fatigue lifetime of the solder materials, strain-based and energy-based models have been widely used. In these models, the effects of temperature and loading frequency are not accounted for.…”

Section: Introductionmentioning

confidence: 99%

Temperature‐dependent fatigue modelling of a novel Ni, Bi and Sb containing Sn‐3.8Ag‐0.7Cu lead‐free solder alloy

Tao

Benabou

et al. 2020

Fatigue Fract Eng Mat Struct

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Low-cycle fatigue testing of a lead-free solder (InnoLot) based on Sn-3.8Ag-0.7Cu (SAC387) with three simultaneous additions of bismuth, nickel and antimony was conducted using miniature-sized fatigue specimens at different temperatures and strain amplitudes. The experiments show a decline of the load capacity of the solder alloy with the number of loading cycles. The fatigue life of the solder is also decreased by the level of imposed temperature. The temperature-modified Coffin

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Section: Introductionmentioning

confidence: 99%

Temperature‐dependent fatigue modelling of a novel Ni, Bi and Sb containing Sn‐3.8Ag‐0.7Cu lead‐free solder alloy

Tao

Benabou

et al. 2020

Fatigue Fract Eng Mat Struct

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“…Many workers have studied the fatigue behavior of lead-free solders [3][4][5][6][7][8][9]. For example, Fakpan et al [3] conducted the fatigue crack growth test of Sn3.0Ag0.5Cu solder, and indicated that the crack growth behavior of the solder was mainly depended on the testing frequency and temperature.…”

Section: Introductionmentioning

confidence: 99%

“…For example, Fakpan et al [3] conducted the fatigue crack growth test of Sn3.0Ag0.5Cu solder, and indicated that the crack growth behavior of the solder was mainly depended on the testing frequency and temperature. At low frequency and high temperature, it was predominantly time-dependent, while cycle became determinant at high frequency and low temperature.…”

Section: Introductionmentioning

confidence: 99%

Low-cycle fatigue failure behavior and life evaluation of lead-free solder joint under high temperature

Zhu

Gao

et al. 2014

Microelectronics Reliability

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“…The SAC305 solder paste alloy material used was provided by Nihon Handa Co., Ltd. (Tokyo, Japan). The chemical composition and general properties of the solder material are given in Tables 1 and 2 [21], respectively. Two types of open cells foam, namely porous Cu interlayer of 15 pore per inch (ppi) and 25 ppi, signified as P15 and P25, were used as the solder joint reinforcement.…”

Section: Materials Selectionmentioning

confidence: 99%

Utilization of a Porous Cu Interlayer for the Enhancement of Pb-Free Sn-3.0Ag-0.5Cu Solder Joint

Jamadon

Tan

Yusof

et al. 2016

Metals

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Abstract:The joining of lead-free Sn-3.0Ag-0.5Cu (SAC305) solder alloy to metal substrate with the addition of a porous Cu interlayer was investigated. Two types of porous Cu interlayers, namely 15 ppi-pore per inch (P15) and 25 ppi (P25) were sandwiched in between SAC305/Cu substrate. The soldering process was carried out at soldering time of 60, 180, and 300 s at three temperature levels of 267, 287, and 307 • C. The joint strength was evaluated by tensile testing. The highest strength for solder joints with addition of P25 and P15 porous Cu was 51 MPa (at 180 s and 307 • C) and 54 MPa (at 300 s and 307 • C ), respectively. The fractography of the solder joint was analyzed by optical microscope (OM) and scanning electron microscopy (SEM). The results showed that the propagation of fracture during tensile tests for solder with a porous Cu interlayer occurred in three regions: (i) SAC305/Cu interface; (ii) inside SAC305 solder alloy; and (iii) inside porous Cu. Energy dispersive X-ray spectroscopy (EDX) was used to identify intermetallic phases. Cu 6 Sn 5 phase with scallop-liked morphology was observed at the interface of the SAC305/Cu substrate. In contrast, the scallop-liked intermetallic phase together with more uniform but a less defined scallop-liked phase was observed at the interface of porous Cu and solder alloy.

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Creep–Fatigue Crack Growth Behavior of Pb-Containing and Pb-Free Solders at Room and Elevated Temperatures

Cited by 15 publications

References 12 publications

Temperature‐dependent fatigue modelling of a novel Ni, Bi and Sb containing Sn‐3.8Ag‐0.7Cu lead‐free solder alloy

Temperature‐dependent fatigue modelling of a novel Ni, Bi and Sb containing Sn‐3.8Ag‐0.7Cu lead‐free solder alloy

Low-cycle fatigue failure behavior and life evaluation of lead-free solder joint under high temperature

Utilization of a Porous Cu Interlayer for the Enhancement of Pb-Free Sn-3.0Ag-0.5Cu Solder Joint

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