Creep-fatigue interactions in solders

Tien, J. K.; Hendrix, B. C.; Bretz, Peter L.; Attarwala, A.I.

doi:10.1109/33.49007

Cited by 25 publications

(2 citation statements)

References 7 publications

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“…This situation is also described as creep-fatigue interaction phenomenon which occurred in the bulk eutectic SnPb alloy. Such a phenomenon was also observed by Kuo et al [2], Tien et al [5] and Tien et al [6]. It was also observed that mechnical cycling at R=0.1 and R=-0.5 at various applied strains and temperature do not contribute to instantaneous stress relaxation to a zero value, as Figure 7 (a) and (b) revealed.…”

Section: Resultssupporting

confidence: 81%

Stress Relaxation and Fatigue Characterisation of Eutectic SnPb Solder Alloy

Hashim¹,

Rahmat

2011

KEM

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Soldering is the most important joining technology in the semiconductor industry, especially for IC chip packaging. The binary eutectic SnPb alloy had been in used for decades, before regulations and restriction on the usage of lead in solders was imposed. Thus, replacing SnPb solder alloy with Pb-free solders has also been an issue in the electronic industry. The previously used SnPb alloy was in used due to several reasons, namely (a) it has low melting temperature (183oC) and solidified at a single temperature to form eutectoid composition, (b) binary in composition and is readily available commercially and (c) many researches had been undertaken in the previous decades. Creep, stress relaxation and fatigue tests were conducted on eutectic SnPb solder alloy in order to study the alloy mechanical characteristics, and hence a suitable Pb-free solder alloy could be chosen as a replacement alloy. In this study, creep, stress relaxation and fatigue tests were conducted on eutectic SnPb solder alloy at 30oC and 50oC, respectively. The study showed that stress relaxation in the alloy decayed instantaneously to zero-value when cycling was done at R=-1 and that cycling was done at 600 cycle per minute (CPM) which enable fatigue test to be conducted on the bulk solder alloy. A non-zero stress relaxation value will result in the alloy to failed predominantly due to creep and fatigue failure will not be observed.

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Section: Resultssupporting

confidence: 81%

Stress Relaxation and Fatigue Characterisation of Eutectic SnPb Solder Alloy

Hashim¹,

Rahmat

2011

KEM

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“…To provide information which will lead to improvements in the reliability of these alloys, a number of studies have dealt with topics such as isothermal fatigue, creepfatigue interaction, microstructural effects and thermal cycling behavior both of solder joints as well as bulk material behavior. [1][2][3][4][5][6][7][8] However, only limited research has been reported on fatigue crack growth behavior of solder materials. 9 Fatigue is a process of crack initiation and propagation, and it has been reported that crack propagation is dominant in determining the fatigue life of solder joints.…”

Section: Introductionmentioning

confidence: 99%