Critical Parameters of Solution Design for Electrodeposition of 2.4 T CoFe Alloys

Abstract

The electrodeposition of soft, high magnetic moment alloys has become the critical fabrication step in manufacturing of magnetic recording heads. The need for ultimately high magnetic moment alloys (2.4 T CoFe) and the electrodeposition process capable of delivering magnetic structures with dimension in the range of several tens of nanometers are the new tasks that have to be addressed if the future magnetic recording devices will use the electrodeposited alloys for writing pole application. This complex challenge could be successfully achieved by fully considering the conditions at the electrochemical interface for additive adsorption and incorporation, iron hydroxide formation and incorporation, and by careful design of the bath chemistry and deposition parameters that would yield the high moment alloys with the optimum magnetic properties. In this manuscript, some of the key aspects of successful electrodeposition of 2.4 T CoFe alloys are discussed with experimental results and theoretical foundations indicating future direction for development of electrodeposited high moment alloys and nanostructures.

Oxygen Incorporation into Electrodeposited CoFe Films: Consequences for Structure and Magnetic Properties

“…Based on previous calculations, in S2, the predominant oxide phase was expected to be Fe 2 O 3 • xH 2 O, which comes primarily from the introduction of Ferric Sulfate (Fe 2 SO 4 ) 3 into the electrodeposition bath. 17,22 Accordingly, we expected S2 would have higher amount of oxide phase than S1 since the value of interfacial pH is significantly larger than the threshold required for precipitation of Fe(OH) 3 (Eq. 1).…”

Electrochemical Deposition of Copper in Graphene Quantum Dot Bath: Pool Boiling Enhancement

“…The electrodeposition of copper for variety of purposes has been investigated using either acidic copper sulfate medium or alkaline medium or complexing medium. [20][21][22][23][24][25][26] The sulfate medium for copper deposition has been examined for pool boiling. 19,27 The cyclic voltammetry of cupric ion reduction in sulfate medium proceeds with a cathodic peak caused by 2e uptake by the cupric ion followed by a complimentary anodic peak caused by stripping of the deposited copper metal.…”

“…The electrochemical deposition of copper has been carried out in the literature by using aqueous baths containing electrolytes [20][21][22][23][24][25][26][27][28][29][30][31][32][33][34][35][36][37][38] in acidic or basic or complexing medium. The morphology of the deposited copper is dependent on the medium.…”

Influence of Deposition Parameters on Mechanical Stress and Magnetic Properties in Thick, Electroplated Co-Fe Flux Guides

“…The favorable properties in combination with the severe disadvantages of iron-rich Co-Fe alloys triggered a great amount of research aiming at the minimization of film stress and corrosion sensitivity as well as the optimization of the magnetic properties (1)(2)(3)(4)(5). In previous studies (6,7), we examined very high (20 µm) ring-shaped Co-Fe flux guide structures for a 3D, ultra-thin magnetic field sensor.…”