2020
DOI: 10.1109/tcad.2020.2970019
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Cross-Layer Co-Optimization of Network Design and Chiplet Placement in 2.5-D Systems

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Cited by 27 publications
(3 citation statements)
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“…The total power of the laser, SOA, DAC, and ADC in E-O-E control for 5 parallel read operations is 9.3mW , resulting in a read energy of 11.6pJ/bit for COSMOS-4bit. The energy consumed in the electrical links connecting the processor and the E-O-E control unit is < 1pJ/bit [22]. For EPCM, we use NVSim [25] to compute the energy-per-bit for read and write operations.…”
Section: A Cosmos Vs Epcmmentioning
confidence: 99%
“…The total power of the laser, SOA, DAC, and ADC in E-O-E control for 5 parallel read operations is 9.3mW , resulting in a read energy of 11.6pJ/bit for COSMOS-4bit. The energy consumed in the electrical links connecting the processor and the E-O-E control unit is < 1pJ/bit [22]. For EPCM, we use NVSim [25] to compute the energy-per-bit for read and write operations.…”
Section: A Cosmos Vs Epcmmentioning
confidence: 99%
“…As Moore's Law scaling is nearing its end, the traditional monolithic silicon chip, for which a flaw in one part can make the entire device unusable, is being abandoned in favor of systemson-chip (SoC), composed of multiple small chiplets leading to less complex integrated circuits, which can be built in the most efficient manufacturing process according to their characteristics. Advanced packaging technologies and substrate design, which allows for much higher bandwidth between chiplets, have enabled integrating chiplets from different manufacturing process flows into a single package [2,11,22,26]. Thus, disintegrating complex chips improves yield and reduces costs, while accommodating more easily specialized systems, with the net result of being nowadays adopted by most major hardware manufacturers in their current micropro-nario, these fundamental libraries will suffer from the rapid evolution on the complexity of architectures, and hence techniques and methodologies for rapid adaptation will become mandatory.…”
Section: Introductionmentioning
confidence: 99%
“…PCBs are mature and cost-effective, but their lengthy and wide traces cause a high inductance and capacitance, restricted bandwidth and substantial power losses [2,3]. As a result, interposer-based 2.5-D IC integration has received a lot of interest as a way to overcome the constraints of 2-D IC integrations [4,5]. Based on an interposer, 2.5-D IC integration separates a single SoC into numerous functional blocks known as chiplets, which are placed side-by-side on the interposer and coupled with high speed and bandwidth through the interposer.…”
Section: Introductionmentioning
confidence: 99%