We present a detailed
atomic-resolution study of morphology and
substrate etching mechanism in InAs/InP droplet epitaxy quantum dots
(QDs) grown by metal–organic vapor phase epitaxy via cross-sectional
scanning tunneling microscopy (X-STM). Two different etching processes
are observed depending on the crystallization temperature: local drilling
and long-range etching. In local drilling occurring at temperatures
of ≤500 °C, the In droplet locally liquefies the InP underneath
and the P atoms can easily diffuse out of the droplet to the edges.
During crystallization, the As atoms diffuse into the droplet and
crystallize at the solid–liquid interface, forming an InAs
etch pit underneath the QD. In long-range etching, occurring at higher
temperatures of >500 °C, the InP layer is destabilized and
the
In atoms from the surroundings migrate toward the droplet. The P atoms
can easily escape from the surface into the vacuum, forming trenches
around the QD. We show for the first time the formation of trenches
and long-range etching in InAs/InP QDs with atomic resolution. Both
etching processes can be suppressed by growing a thin layer of InGaAs
prior to the droplet deposition. The QD composition is estimated by
finite element modeling in combination with X-STM. The change in the
morphology of QDs due to etching can strongly influence the fine structure
splitting. Therefore, the current atomic-resolution study sheds light
on the morphology and etching behavior as a function of crystallization
temperature and provides a valuable insight into the formation of
InAs/InP droplet epitaxy QDs which have potential applications in
quantum information technologies.