Crosstalk Reduction Using Defective Ground Plane Structures In RF Printed Circuit Boards

Sindhadevi, M.; Kanagasabai, Malathi; Henridass, A.; Shrivastav, A. K.

doi:10.1007/s13369-013-0720-0

Cited by 3 publications

(2 citation statements)

References 4 publications

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“…The proposed structure [18] of two closely spaced transmission lines are shown in Fig. 3 The analyses of crosstalk reduction were done by embedding the EBG structures in array type configuration.…”

Section: Proposed Crosstalk Reduction Methods Coupled Line -mentioning

confidence: 99%

Signal Integrity Analysis of High Speed Interconnects In PCB Embedded with EBG Structures

Sindhadevi¹,

Kanagasabai²,

Arun³

et al. 2016

Journal of Electrical Engineering and Technology

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-This paper brings out a novel method for reducing Near end and Far end Crosstalk using Electromagnetic Band Gap structures (EBG) in High Speed RF transmission lines. This work becomes useful in high speed closely spaced Printed Circuit Board (PCB) traces connected to multi core processors. By using this method, reduction of -40dB in Near-End Crosstalk (NEXT) and -60 dB in Far End Crosstalk (FEXT) is achieved. The results are validated through experimental measurements. Time domain analysis is performed to validate the signal integrity property of coupled transmission lines.

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Section: Proposed Crosstalk Reduction Methods Coupled Line -mentioning

confidence: 99%

Signal Integrity Analysis of High Speed Interconnects In PCB Embedded with EBG Structures

Sindhadevi¹,

Kanagasabai²,

Arun³

et al. 2016

Journal of Electrical Engineering and Technology

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“…An innovative DGS approach using irregularly-spaced vias connecting the PCB traces over a slotted ground plane is proposed in [5]. The effectiveness of the DGS solution was verified to reduce radio frequencies and broadband EMIs from active PCBs [6], [7]. The effectiveness of crosstalk suppression was validated from mode mismatch between spoof SPP microstrip transmission line (TL) [8].…”

Section: Introductionmentioning

confidence: 99%

NGD Analysis of Defected Ground and SIW-Matched Structure

Gu,

Wan,

et al. 2023

Chinese J. Elect.

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A bandpass negative group delay (NGD) passive circuit based on defect ground structure (DGS) and substrate integrated waveguide (SIW)-matched is developed in the paper. The NGD DGS topology is originally built with notched cells associated with self-matched substrate waveguide elements. The DGS design method is introduced as a function of the geometrical notched and SIW via elements. Then, parametric analyses based on full wave 3-D electromagnetic S-parameter simulations were considered to investigate the influence of DGS physical size effects. The design method feasibility study is validated with fully distributed microstrip circuit prototype. Significant bandpass NGD function performances were validated with 3-D simulations and measurements with −1.69 ns negative group delay value around 2 GHz center frequency over 33.7 MHz NGD bandwidth. Insertion loss is 4.37 dB, and reflection loss reaches 41.5 dB.

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Signal Integrity Performance Analysis of Mutual Coupling Reduction Techniques Using DGS in High Speed Printed Circuit Boards

Sindhadevi

Kanagasabai

Henridass

et al. 2016

Wireless Pers Commun

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Crosstalk Reduction Using Defective Ground Plane Structures In RF Printed Circuit Boards

Cited by 3 publications

References 4 publications

Signal Integrity Analysis of High Speed Interconnects In PCB Embedded with EBG Structures

Signal Integrity Analysis of High Speed Interconnects In PCB Embedded with EBG Structures

NGD Analysis of Defected Ground and SIW-Matched Structure

Signal Integrity Performance Analysis of Mutual Coupling Reduction Techniques Using DGS in High Speed Printed Circuit Boards

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