Signal Integrity Analysis of High Speed Interconnects In PCB Embedded with EBG Structures

Sindhadevi, M.; Kanagasabai, Malathi; Arun, Henridass; Shrivastav, A. K.

doi:10.5370/jeet.2016.11.1.175

Cited by 4 publications

(2 citation statements)

References 19 publications

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“…Firstly, signal integrity (SI) degrades as the number of split channels increases due to the increase of impedance mismatching and cross talk [14,15]. Secondly, if one of the split lines has a short-circuit defect, all shared (branched) lines could malfunction as illustrated in Fig.…”

Section: Protection Resistors Of a High Parallelism Probe Cardmentioning

confidence: 99%

NAC Measurement Technique on High Parallelism Probe Card with Protection Resistors

Kim¹,

Nah²

2016

JSTS:Journal of Semiconductor Technology and Science

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Abstract-In this paper, a novel time-domain measurement technique on a high parallelism probe card with protection resistors installed is proposed. The measured signal amplitude decreases when the measurement is performed by Needle Auto Calibration (NAC) probing on a high parallelism probe card with installed resistors. Therefore, the original signals must be carefully reconstructed, and the compensation coefficient, which is related to the number of channel branches and the value of protection resistors, must be introduced. The accuracy of the reconstructed signals is analyzed based on the varying number of channel branches and various protection resistances. The results demonstrate that the proposed technique is appropriate for evaluating the overall signal performance of probe cards with Automatic Test Equipment (ATE), which enhances the efficiency of probe card performance test dramatically.

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Section: Protection Resistors Of a High Parallelism Probe Cardmentioning

confidence: 99%

NAC Measurement Technique on High Parallelism Probe Card with Protection Resistors

Kim¹,

Nah²

2016

JSTS:Journal of Semiconductor Technology and Science

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“…Recently, miniaturization and high-integration in the electronic systems have caused various problems in signal integrity and power integrity [1][2][3]. As the signal is transmitted at high-speed, problems such as crosstalk and reflection may occur in the electronic system and then these can degrade its signal quality.…”

Section: Introductionmentioning

confidence: 99%

Signal/Power Integrity Analysis of High-Speed Memory Module with Meshed Reference Plane

Kim¹

2018

IJCA

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In this paper, the signal integrity and power integrity of mesh patterns are investigated in the Double Data Rate 4 Small Outline Dual In-line Memory Module (DDR4 SODIMM). The mesh patterns are designed to be a square in the power plane and are repeated periodically with a spacing of 1 mm. The sizes of the mesh patterns are considered in terms of the operating speed of the DDR4 SODIMM and its wavelength. The effect of signal integrity on the address line is analyzed as the mesh size increases. The eye-diagram analysis of the address line is also carried out by comparing the aperture factor. As the mesh size increases, the eye-diagram aperture decreases. It is verified that the mesh size of 1 mm 2 or less has little effect on the signal transmission of the address line. The power integrity of the power planes with different mesh patterns is analyzed. The effect of resonance and impedance on the power-ground plane is investigated. In this work, it is demonstrated that the mesh size smaller than 1 mm 2 has the same impedance results as the solid plane. However, as the mesh size exceeds 1 mm 2 , the impedance increases in all frequency ranges.

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Noise mitigation in high-speed PCB applications: experimental verification and validation of electromagnetic band gap filters

Maheswari

Amudha

Kumar

2022

Journal of Electromagnetic Waves and Applications

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Signal Integrity Analysis of High Speed Interconnects In PCB Embedded with EBG Structures

Cited by 4 publications

References 19 publications

NAC Measurement Technique on High Parallelism Probe Card with Protection Resistors

NAC Measurement Technique on High Parallelism Probe Card with Protection Resistors

Signal/Power Integrity Analysis of High-Speed Memory Module with Meshed Reference Plane

Noise mitigation in high-speed PCB applications: experimental verification and validation of electromagnetic band gap filters

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