Cryogenic dry etching for high aspect ratio microstructures

Murakami, Kenkichi; Wakabayashi, Yoshihiro; Minami, Kazuyuki; Esashi, Masayoshi

doi:10.1109/memsys.1993.296953

Cited by 32 publications

(15 citation statements)

References 1 publication

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“…6.2(d) [24,25] , have also been widely applied to bulk silicon etching. It should be pointed out that many other techniques like silicon fusion bonding [26] , silicon-to-glass anodic bonding [27] , electrode discharge machining (EDM) [28,29] , and laser machining [30] , are often used with silicon bulk micromachining as well.…”

Section: Bulk Micromachiningmentioning

confidence: 99%

Introduction to MEMS

Tai

2012

Microsystems and Nanotechnology

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The first research on MEMS can be traced all the way back to the 50's [1] . In the 80's, there was a burst of MEMS using semiconductor materials. In the 90's, MEMS was formally an emerging technology. Today, MEMS has grown to be a big field with hectic international competition on many commercial applications. Without doubt, MEMS is already ubiquitous, but various new MEMS devices are continuing to show up. There is no end in sight as we continue to see MEMS branch into new fields and applications. At the same time, though, there is still much to do with both science and technology issues because of its 'multidisciplinary' and 'system' nature. MEMS is becoming more exciting than ever considering its bright long-term prospects going into BioMEMS and NEMS. There is no doubt that MEMS will be a key factor for bridging our world into nanotechnology. The best day for MEMS is yet to come with a continuous drive to make our life smaller, cheaper, and better.

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Section: Bulk Micromachiningmentioning

confidence: 99%

Introduction to MEMS

Tai

2012

Microsystems and Nanotechnology

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“…18 Drop port responses for different series coupled rings developed analytically Boer et al 2000;Sarajlic et al 2003;Marty et al 2005;Sworowski et al 2009). The isotropic process mentioned above was combined with the anisotropic process either Bosch process (Laermer and Schilp 1996) or cryogenic process (Murakami et al 1993;Saadany et al 2006). Though such combination was already reported in the form of anisotropic-isotropic sequence (De Boer et al 2000;Sarajlic et al 2003;Sworowski et al 2009) and applied to microfluidic (De Boer et al 2000) and RF (Sworowski et al 2009) devices, our aim is to apply it to optical waveguides, by means of the introduction of additional anisotropic step, as compared to these previous reports and as shown in Fig.…”

Section: Dwdm Versus Cwdmmentioning

confidence: 99%

Design of CWDM multiplexers based on series coupled ring resonators: analysis, potential and prospects on MEMS fabrication technologies

et al. 2010

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New designs for a 1 9 4 and a 1 9 8 CWDM multiplexers based on cascaded groups of series coupled ring resonators (Little et al. in proposed circuits offer superior performance in their very sharp roll-off factor that exceeds 0.75, their reduced crosstalk level that lies below -60 dB and their negligible insertion loss for the 1 9 4 design. For the 1 9 8 design, the worst case insertion loss is 4 dB. However, the performances obtained exhibit passband ripples in the order of 5 dB, and besides, they are not very tolerant to fabrication errors. Being designed for SOI technology, the proposed circuits are compact as the circuit areas are 130 9 130 and 90 9 150 lm 2 for the 1 9 4 and 1 9 8 designs, respectively. They also have a high potential for MEMS tunability.

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“…in recent years, with the emergence of microelectromechanical systems (MEMS), polyimide has also been employed in MEMS fabrication for a variety of applications, for example as a structural membrane layer in RF MEMS capacitive switches 131, a sacrificial material for surface micromaching [4] and MEMS assembly [SI, and a mould material for fabrication of high resolution and high aspect ratio 3-D microsmrctures [6]. In most cases, polyimide is spin coated on wafers and patterned into structures.…”

Section: Introductionmentioning

confidence: 99%

Surface enhanced Raman spectroscopy for non-destructive analysis of surfaces following excimer laser removal of polyimide

Gao

Holmes

2004 IEEE/SEMI Advanced Semiconductor Manufacturing Conference and Workshop (IEEE Cat. No.04CH37530)

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In this study, surface enhanced Raman spectroscopy (SERS) has been investigated as a nondestructive technique for monitoring the cleanliness of gold surfaces following KIF excimer laser removal of -2 pm-thick polyimide films. 1360 cm.' (D line) and 1580 cm.' (G line) carbon sensitive bands were detected in the Raman spectra of samples cleaned with up to 100 laser pulses at fluences in the range 120-140 mJ/cm'. The Raman intensity ratio I& increased with the number of pulses, indicating that graphite-like carbon residues were being broken down into smaller fragments with prolonged exposure. The same two carbon peaks disappeared from the Raman spectra of samples subjected to further cleaning, indicating complete removal of carbon residues from the surface. The results show that SERS is a useM in-situ, nondestructive technique for monitoring polyimide laser ablation and cleaning processes.

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Cryogenic dry etching for high aspect ratio microstructures

Cited by 32 publications

References 1 publication

Introduction to MEMS

Introduction to MEMS

Design of CWDM multiplexers based on series coupled ring resonators: analysis, potential and prospects on MEMS fabrication technologies

Surface enhanced Raman spectroscopy for non-destructive analysis of surfaces following excimer laser removal of polyimide

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