“…Prior work on 28-nm FD-SOI technology node has reported cryogenic device behavior extensively [8], [9], [10], [11], [12], [13], [14], [15], [16]. Extensive work on the enhancement of industry standard compact models to include the cryogenic temperature effects has also been reported [17], [18], [19], [20], [21], [22], [23], [24], [25], [26], [27], [28], [29]. The effect of back gate bias towards dc parameter modulation down to cryogenic temperatures was shown in [16], [30], [31].…”