2019
DOI: 10.1039/c9ta01489f
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Cu:NiO as a hole-selective back contact to improve the photoelectrochemical performance of CuBi2O4 thin film photocathodes

Abstract: Cu doped NiO (Cu:NiO) back contact layers are inserted between FTO substrates and CuBi2O4 thin films to improve the performance of CuBi2O4 photocathodes.

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Cited by 83 publications
(84 citation statements)
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“…Figure a compares the transmittance and reflectance of a PLD/RTP‐grown CuBi 2 O 4 film with a CuBi 2 O 4 film fabricated by spray‐pyrolysis. [ 9 ] Both films are deposited on FTO glass and have a similar thickness of ≈250 nm. The transmittance of the CuBi 2 O 4 produced by combined PLD and RTP differs by two features.…”
Section: Resultsmentioning
confidence: 99%
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“…Figure a compares the transmittance and reflectance of a PLD/RTP‐grown CuBi 2 O 4 film with a CuBi 2 O 4 film fabricated by spray‐pyrolysis. [ 9 ] Both films are deposited on FTO glass and have a similar thickness of ≈250 nm. The transmittance of the CuBi 2 O 4 produced by combined PLD and RTP differs by two features.…”
Section: Resultsmentioning
confidence: 99%
“…Despite its favorable characteristics, the development of CuBi 2 O 4 photocathodes suffers from two critical drawbacks: i) photocurrents densities are still well below the theoretical limit due to poor charge separation and transport in the bulk of the films, [ 9 ] and ii) poor photo‐electrochemical stability in aqueous solutions, a common challenge in photocathodes containing Cu. [ 10 ] Efforts to overcome these drawbacks include modifying the FTO/CuBi 2 O 4 interface, [ 9,11,12 ] creating a gradient self‐doping in the CuBi 2 O 4 layer to improve the charge separation efficiency, and using thin protection layers. [ 5,13,14 ] To further improve the study and development of CuBi 2 O 4 photocathodes and to improve their photocurrent densities and stability, [ 15 ] it is necessary to fabricate them with high quality and purity, minimizing impurities and defects.…”
Section: Introductionmentioning
confidence: 99%
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“…the formation of undesirable detrimental phases during processing, could pose a major obstacle to large-scale commercialisation. In recent years, various low-cost semiconductors have emerged, such as Cu 2 S (E g~1 .5 eV) 13 , CuFeO 2 (E g~1 .5 eV) 14 , CuBi 2 O 4 (E g~1 .7 eV) 15 , CuSbS 2 (E g~1 .5 eV) 16 , and SnS (E g~1 .3 eV) 17 . However, none of them have satisfied all the requirements for an ideal semiconductor for PEC water splitting.…”
mentioning
confidence: 99%