Cu–Sn–Zn nanocomposite coatings prepared by TiO2 sol-enhanced electrodeposition

Abstract

Cu-Sn-Zn (CSZ) coatings are widely applied in communication devices due to their excellent performance in electrical/thermal conductivity, solderability, and corrosion resistance. Particularly, a novel TiO 2 -sol-enhanced electrodeposition method has been proposed to prepare CSZ-TiO 2 nanocomposite coatings with different volume fractions of TiO 2 -sol. A series of CSZ-TiO 2 nanocomposite coatings were prepared in the current study. The crystal phase, surface morphology, and micro-to nanostructures of sol-enhanced nanocomposite coatings were characterized by X-ray diffraction (XRD), scanning electron microscopy (SEM), and transmission electron microscopy (TEM). Based on the prior research, we studied the microhardness, surface friction behavior, and corrosion behavior of the coatings. Our results indicate that adding 12.5 mL L −1 TiO 2 -sol increased the average microhardness of CSZ coating from 325 to 421 HV and reduced the corrosion rate by 42.8%. Those results reveal that the TiO 2 -sol affected the performance of CSZ coatings depends on the volume added. Additionally, we investigated the effects of TiO 2 -sol volume fraction on the morphology, microhardness, dry sliding wear-resistant capability, and corrosion-resistant capability.

Effect of Copper and Copper oxide Nanoparticles on The Transient Creep Properties of Sn-4Zn alloy

“…Figures (8)(9)(10) show the relation between (lnεtr) and (lnt) at 303 K, 333 K, and 373 K temperatures respectively, and under different seven applied stress values ranging between 10 and 24MPa. The strain rate ranges from 9.7x10 -6 to 13x10 -6 for and from 1.0x10 -5 to 16x10 -3 for Sn-4Zn and from 5.0x10 -6 to 55x10 -3 for Sn-4Zn-1.5Cu (NPS) see Figures (11,12).…”

“…grinding materials [6] and electrostatic deposition [7,8]. Also, it was excessively utilized for telecommunication apparatus because of its premium achievement for hot / electricity accessibility, welding ability, and abrasion resistance [8].…”

Failure Analysis of Printed Circuit Board Solder Joint under Thermal Shock

“…At present, the solder used in PCB manufacture is mainly lead-free solder [5][6][7][8][9][10]. The most commonly used lead-free solders mainly include Sn-Ag [11][12][13][14], Sn-Cu [15][16][17][18], Sn-Zn [19][20][21][22], and Sn-Ag-Cu (SAC) [23][24][25]. SAC305 solder [26] is widely used because of its high performance and low cost.…”

Ti/SnO2-Sb2Ox-TiO2 Electrodeposited from Methanesulfonate Electrolytes: Preparation, Properties, and Performance

“…Wu et al [14] prepared a high-performance duplex-structured Ti/SnO 2 -Sb 2 O x -CNT composite anode using the electrodeposition method. In our recent studies, a sol-enhanced electrodeposition method has been proposed to efficiently dope inert nanoparticles and achieve their well-dispersion into the coating [15][16][17][18], which can serve as a promising method for Ti/SnO 2 -Sb 2 O x modification.…”